浮动假体填充效果分析:从特征尺度分析到全片RC提取

Keun-Ho Lee, Jin-Kyu Park, Young-Nam Yoon, Dai-Hyun Jung, J. Shin, Young-Kwan Park, J. Kong
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引用次数: 35

摘要

研究了仿真填充对互连电容和芯片整体平面度的影响,为仿真填充的设计提供指导。提出了一种简单而准确的全芯片RC提取方法,并首次将其应用于分析全局互连的电容变化和信号延迟。0.18 /spl mu/m设计的结果清楚地表明,在互连建模和全芯片RC提取中考虑浮动假体填充的重要性。
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Analyzing the effects of floating dummy-fills: from feature scale analysis to full-chip RC extraction
Studies the effects of dummy-fills on the interconnect capacitance and the global planarity of chips in order to provide the design guideline of the dummy-fills. A simple but accurate full-chip RC extraction methodology taking the floating dummy-fills into account is proposed and applied to the analysis of changes in capacitance and signal delay of the global interconnects, for the first time. The results for 0.18 /spl mu/m designs clearly demonstrate the importance of considering floating dummy-fills in the interconnect modeling and the full-chip RC extraction.
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