Direct writing for three-dimensional microfabrication using synchrotron radiation etching

T. Katoh, N. Nishi, M. Fukagawa, H. Ueno, S. Sugiyama
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引用次数: 59

Abstract

This paper presents rapid three-dimensional microfabrication technologies for PTFE by direct writing with the TIEGA process, a LIGA-like process which replaces hard X-ray lithography with synchrotron radiation (SR) direct photo-etching. The etching rates of this process are of the order of 6-100 /spl mu/m/min, depending on the photon flux of the SR light. An X-ray lathe has been modified into an SR etching lathe to form cylindrical, helical, pyramidal, ellipsoidal, and other nonplanar objects. A metallic wire covered with a PTFE sheet is rotated and/or moved while being irradiated with SR through a mask. Moreover, direct writing without using any masks has been developed, by combining a scanning stage with a high degree of freedom under an He atmosphere, for creating any microstructure. The capabilities of these technologies and initial fabrication results are described here.
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用同步辐射蚀刻直接写入三维微加工
本文介绍了用TIEGA工艺直接刻写PTFE的快速三维微加工技术,TIEGA工艺是一种类似liga的工艺,用同步辐射(SR)直接光蚀刻代替硬x射线光刻。该工艺的蚀刻速率约为6-100 /spl mu/m/min,取决于SR光的光子通量。一个x射线车床已被修改成一个SR蚀刻车床形成圆柱,螺旋,锥体,椭球体,和其他非平面的对象。在通过掩膜用SR照射时,旋转和/或移动覆盖有聚四氟乙烯片的金属丝。此外,通过在He气氛下结合具有高度自由度的扫描阶段,开发了不使用任何掩模的直接书写,以创建任何微观结构。本文描述了这些技术的性能和初步制造结果。
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