Pub Date : 2000-09-25DOI: 10.1109/MEMSYS.2000.838492
Xuan-Qi Wang, Y. Tai
We present here the first surface-micromachined, normally closed, in-channel, Parylene check valve. This device is fabricated monolithically on a silicon substrate using a five-layer Parylene process. The operating structure of the check valve is a circular sealing plate on top of a ring-shaped valve seat. The sealing plate is center-anchored on top of a chamber diaphragm that is vacuum-collapsed to the bottom of the chamber in order to achieve a normally closed position. A thin gold layer on the roughened valve seat surface is used to reduce stiction between the sealing plate and the valve seat. We have achieved an in-channel check valve with a cracking (opening) pressure of 20/spl sim/40 kPa under forward bias and no measurable leakage under reverse bias up to 270 kPa. Using this design, this valve performs well in two-phase microfluidic systems (i.e. microchannel flows containing gas, liquid, or gas/liquid mixture).
{"title":"A normally closed in-channel micro check valve","authors":"Xuan-Qi Wang, Y. Tai","doi":"10.1109/MEMSYS.2000.838492","DOIUrl":"https://doi.org/10.1109/MEMSYS.2000.838492","url":null,"abstract":"We present here the first surface-micromachined, normally closed, in-channel, Parylene check valve. This device is fabricated monolithically on a silicon substrate using a five-layer Parylene process. The operating structure of the check valve is a circular sealing plate on top of a ring-shaped valve seat. The sealing plate is center-anchored on top of a chamber diaphragm that is vacuum-collapsed to the bottom of the chamber in order to achieve a normally closed position. A thin gold layer on the roughened valve seat surface is used to reduce stiction between the sealing plate and the valve seat. We have achieved an in-channel check valve with a cracking (opening) pressure of 20/spl sim/40 kPa under forward bias and no measurable leakage under reverse bias up to 270 kPa. Using this design, this valve performs well in two-phase microfluidic systems (i.e. microchannel flows containing gas, liquid, or gas/liquid mixture).","PeriodicalId":251857,"journal":{"name":"Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308)","volume":"44 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-09-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116647592","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2000-01-23DOI: 10.1109/MEMSYS.2000.838589
L. An, Wenge Zhang, V. Bright, M. Dunn, R. Raj
In this paper, a novel processing technique for fabrication of high temperature MEMS is reported. The process consists of four steps: (1) casting a liquid polymer precursor into molds with desired structures; (2) heating the filled mold for thermosetting the polymer; (3) bonding different solid polymer parts together using the same liquid polymer as an adhesive; (4) converting the polymer to a ceramic by thermal decomposition. The technology allows implementation of MEMS components with complex three-dimensional, multi-layer structures. The resultant polymer-derived ceramics, based-on amorphous alloys of silicon, carbon and nitrogen, can be used at temperatures up to 1500/spl deg/C.
{"title":"Development of injectable polymer-derived ceramics for high temperature MEMS","authors":"L. An, Wenge Zhang, V. Bright, M. Dunn, R. Raj","doi":"10.1109/MEMSYS.2000.838589","DOIUrl":"https://doi.org/10.1109/MEMSYS.2000.838589","url":null,"abstract":"In this paper, a novel processing technique for fabrication of high temperature MEMS is reported. The process consists of four steps: (1) casting a liquid polymer precursor into molds with desired structures; (2) heating the filled mold for thermosetting the polymer; (3) bonding different solid polymer parts together using the same liquid polymer as an adhesive; (4) converting the polymer to a ceramic by thermal decomposition. The technology allows implementation of MEMS components with complex three-dimensional, multi-layer structures. The resultant polymer-derived ceramics, based-on amorphous alloys of silicon, carbon and nitrogen, can be used at temperatures up to 1500/spl deg/C.","PeriodicalId":251857,"journal":{"name":"Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308)","volume":"16 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-01-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116641708","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2000-01-23DOI: 10.1109/MEMSYS.2000.838551
Young-Ho Lee, T. Kang, Young‐Ho Cho
This paper characterizes a bi-directionally oscillating dynamic flow in a planar microdiffuser in order to evaluate the flow rectification performance of the microdiffuser. In the theoretical study, we present a bidirectionally oscillating flow model, where the boundary layer thickness governs the flow rectification performance of the microdiffuser. In the experimental study, we fabricate two different microdiffuser prototypes, having the neck widths of 100 /spl mu/m (D100) and 300 /spl mu/m (D300), respectively. The prototypes, D100 and D300, show the maximum net flow rates of 116.6 /spl mu/l/min and 344.4 /spl mu/l/min, respectively, for an identical piezoelectric flow actuation using the sinusoidal drive voltage of 100 V p-p at 50 Hz. The flow rates measured from D100 and D300 are approximately 47% of the theoretical values estimated from the conventional unidirectional flow model for the net boundary layer thicker than the neck width. The experimental flow rate of D300, however, decreases from 47% of the theoretical values at the flow frequencies higher than 90 Hz, at which the net boundary layer thickness is reduced to the microdiffuser neck width. It is experimentally verified that the flow rectification performance and the net flow rate of the microdiffuser tend to decrease when the boundary layer thickness is smaller than the diffuser neck width.
{"title":"Characterization of bi-directionally oscillating dynamic flow and frequency-dependent rectification performance of microdiffusers","authors":"Young-Ho Lee, T. Kang, Young‐Ho Cho","doi":"10.1109/MEMSYS.2000.838551","DOIUrl":"https://doi.org/10.1109/MEMSYS.2000.838551","url":null,"abstract":"This paper characterizes a bi-directionally oscillating dynamic flow in a planar microdiffuser in order to evaluate the flow rectification performance of the microdiffuser. In the theoretical study, we present a bidirectionally oscillating flow model, where the boundary layer thickness governs the flow rectification performance of the microdiffuser. In the experimental study, we fabricate two different microdiffuser prototypes, having the neck widths of 100 /spl mu/m (D100) and 300 /spl mu/m (D300), respectively. The prototypes, D100 and D300, show the maximum net flow rates of 116.6 /spl mu/l/min and 344.4 /spl mu/l/min, respectively, for an identical piezoelectric flow actuation using the sinusoidal drive voltage of 100 V p-p at 50 Hz. The flow rates measured from D100 and D300 are approximately 47% of the theoretical values estimated from the conventional unidirectional flow model for the net boundary layer thicker than the neck width. The experimental flow rate of D300, however, decreases from 47% of the theoretical values at the flow frequencies higher than 90 Hz, at which the net boundary layer thickness is reduced to the microdiffuser neck width. It is experimentally verified that the flow rectification performance and the net flow rate of the microdiffuser tend to decrease when the boundary layer thickness is smaller than the diffuser neck width.","PeriodicalId":251857,"journal":{"name":"Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308)","volume":"4 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-01-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117126456","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2000-01-23DOI: 10.1109/MEMSYS.2000.838553
A. Han, K. Oh, S. Bhansali, H. Thurman Henderson, C. Ahn
A new low temperature biochemically compatible bonding technique using fluoropolymers has been developed in this work and characterized in terms of mechanical bonding strength and biochemical resistance. This bonding technique uses a spin-on Teflon-like amorphous fluorocarbon polymer (CYTOP/sup TM/) as a bonding interface layer. The developed bonding process requires a bonding temperature of 160/spl deg/C and the bonding strength attained from the process shows 4.3 Mpa in silicon-to-silicon. Furthermore, the bonding technique achieves reliable and leak-proof bonding in various substrates and provides excellent chemical resistance and biocompatibility for some specific immunoassays. The bonding technique developed in this work has been successfully applied to the development of a microfluidic motherboard system with surface mountable microfluidic components.
{"title":"A low temperature biochemically compatible bonding technique using fluoropolymers for biochemical microfluidic systems","authors":"A. Han, K. Oh, S. Bhansali, H. Thurman Henderson, C. Ahn","doi":"10.1109/MEMSYS.2000.838553","DOIUrl":"https://doi.org/10.1109/MEMSYS.2000.838553","url":null,"abstract":"A new low temperature biochemically compatible bonding technique using fluoropolymers has been developed in this work and characterized in terms of mechanical bonding strength and biochemical resistance. This bonding technique uses a spin-on Teflon-like amorphous fluorocarbon polymer (CYTOP/sup TM/) as a bonding interface layer. The developed bonding process requires a bonding temperature of 160/spl deg/C and the bonding strength attained from the process shows 4.3 Mpa in silicon-to-silicon. Furthermore, the bonding technique achieves reliable and leak-proof bonding in various substrates and provides excellent chemical resistance and biocompatibility for some specific immunoassays. The bonding technique developed in this work has been successfully applied to the development of a microfluidic motherboard system with surface mountable microfluidic components.","PeriodicalId":251857,"journal":{"name":"Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308)","volume":"60 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-01-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126080976","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2000-01-23DOI: 10.1109/MEMSYS.2000.838598
V. Vivek, E. S. Kim
This paper describes a novel Fresnel Annular Sector Actuator (FASA) and FASA-based micromixers built on PZT substrate. This actuator generates strong lateral acoustic thrusts in liquid, and is very effective in micromixing fluids. Almost any lateral fluidic motion can be produced with appropriate electrode patterns on FASA and with a combination of various FASA elements. We have developed the following three micromixers based on FASA elements: overlap design, four-sector design and six-sector design. Experimental results obtained on the fabricated FASA and micromixers confirm the theory and simulation.
{"title":"Novel acoustic-wave micromixer","authors":"V. Vivek, E. S. Kim","doi":"10.1109/MEMSYS.2000.838598","DOIUrl":"https://doi.org/10.1109/MEMSYS.2000.838598","url":null,"abstract":"This paper describes a novel Fresnel Annular Sector Actuator (FASA) and FASA-based micromixers built on PZT substrate. This actuator generates strong lateral acoustic thrusts in liquid, and is very effective in micromixing fluids. Almost any lateral fluidic motion can be produced with appropriate electrode patterns on FASA and with a combination of various FASA elements. We have developed the following three micromixers based on FASA elements: overlap design, four-sector design and six-sector design. Experimental results obtained on the fabricated FASA and micromixers confirm the theory and simulation.","PeriodicalId":251857,"journal":{"name":"Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-01-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115214483","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2000-01-23DOI: 10.1109/MEMSYS.2000.838512
S. Roth, C. Marxer, G. Feusier, N. D. de Rooij
This paper reports on the fabrication and experimental results of a reed relay for end-course detection application. The end-course is detected by approaching an external magnet near the device. Nickel material has been chosen for the realisation of the device because of its good magnetic properties and its ability to be electrodeposited. The fabrication process requires a single photolithography step. The relay has been fabricated using a 55 /spl mu/m thick positive resist photopatterning process developed in our laboratory. Electrical, static and dynamic characterisations have been performed. The final chip dimensions are 3 mm long, 1 mm wide and 0.4 mm thick.
{"title":"One mask nickel micro-fabricated reed relay","authors":"S. Roth, C. Marxer, G. Feusier, N. D. de Rooij","doi":"10.1109/MEMSYS.2000.838512","DOIUrl":"https://doi.org/10.1109/MEMSYS.2000.838512","url":null,"abstract":"This paper reports on the fabrication and experimental results of a reed relay for end-course detection application. The end-course is detected by approaching an external magnet near the device. Nickel material has been chosen for the realisation of the device because of its good magnetic properties and its ability to be electrodeposited. The fabrication process requires a single photolithography step. The relay has been fabricated using a 55 /spl mu/m thick positive resist photopatterning process developed in our laboratory. Electrical, static and dynamic characterisations have been performed. The final chip dimensions are 3 mm long, 1 mm wide and 0.4 mm thick.","PeriodicalId":251857,"journal":{"name":"Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-01-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129692893","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2000-01-23DOI: 10.1109/MEMSYS.2000.838538
T. Eggers, C. Marschner, U. Marschner, B. Clasbrummel, R. Laur, J. Binder
A new, highly miniaturized hybrid integrated solution for telemetric pressure measurement in biomedical applications is presented. The telemetrically powered ITES (Implantable Telemetric Endo-System) consists of a surface micro-machined capacitive type absolute pressure sensor fabricated in an eight-mask MOS-like process and two low-power ASICs for capacitance change read-out and telemetric data and energy transmission. An advanced flip-chip mounting and assembly technology is applied to overcome most of the drawbacks of hybrid integration and to fulfill space requirements of biomedical implants without monolithic sensor integration. This paper emphasizes system design considerations of the hybrid system such as its partitioning and the mounting and assembly technology. The pressure sensor design and its associated read-out is discussed in detail.
{"title":"Advanced hybrid integrated low-power telemetric pressure monitoring system for biomedical applications","authors":"T. Eggers, C. Marschner, U. Marschner, B. Clasbrummel, R. Laur, J. Binder","doi":"10.1109/MEMSYS.2000.838538","DOIUrl":"https://doi.org/10.1109/MEMSYS.2000.838538","url":null,"abstract":"A new, highly miniaturized hybrid integrated solution for telemetric pressure measurement in biomedical applications is presented. The telemetrically powered ITES (Implantable Telemetric Endo-System) consists of a surface micro-machined capacitive type absolute pressure sensor fabricated in an eight-mask MOS-like process and two low-power ASICs for capacitance change read-out and telemetric data and energy transmission. An advanced flip-chip mounting and assembly technology is applied to overcome most of the drawbacks of hybrid integration and to fulfill space requirements of biomedical implants without monolithic sensor integration. This paper emphasizes system design considerations of the hybrid system such as its partitioning and the mounting and assembly technology. The pressure sensor design and its associated read-out is discussed in detail.","PeriodicalId":251857,"journal":{"name":"Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308)","volume":"58 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-01-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124971435","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2000-01-23DOI: 10.1109/MEMSYS.2000.838580
Xu Zhu, D. Greve, G. Fedder
In this paper, a novel post-CMOS micromachining technique using inductively coupled plasma (ICP) etching is described and the processing space is explored and characterized. Unlike most ICP processes using photoresist as a mask, we demonstrated that aluminum can be used in this type of system. Also, we demonstrated in this hybrid process that vertical and lateral etching can be specified separately. This bulk micromachining process gives more freedom for designing CMOS-MEMS structures, and enhances the reliability and yield of post-CMOS micromachining. The design rules are furthermore extracted from the characterization of the process.
{"title":"Characterization of silicon isotropic etch by inductively coupled plasma etch in post-CMOS processing","authors":"Xu Zhu, D. Greve, G. Fedder","doi":"10.1109/MEMSYS.2000.838580","DOIUrl":"https://doi.org/10.1109/MEMSYS.2000.838580","url":null,"abstract":"In this paper, a novel post-CMOS micromachining technique using inductively coupled plasma (ICP) etching is described and the processing space is explored and characterized. Unlike most ICP processes using photoresist as a mask, we demonstrated that aluminum can be used in this type of system. Also, we demonstrated in this hybrid process that vertical and lateral etching can be specified separately. This bulk micromachining process gives more freedom for designing CMOS-MEMS structures, and enhances the reliability and yield of post-CMOS micromachining. The design rules are furthermore extracted from the characterization of the process.","PeriodicalId":251857,"journal":{"name":"Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308)","volume":"32 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-01-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114703081","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2000-01-23DOI: 10.1109/MEMSYS.2000.838619
S. Kamisuki, M. Fujii, T. Takekoshi, C. Tezuka, M. Atobe
A fully-micromachined, low power, large nozzle count and high resolution "electrostatically actuated inkjet (SEAJet/sup TM/)" head has been developed for a POS printer. As 3D multiple-step structured nozzles are required for straight and high frequency ink ejection, it was formed by ICP deep-RIE employing a "multiple-step mask method" which makes troublesome stereo-photolithography unnecessary and 128 nozzles/chip were fabricated simultaneously. The required thin, 2 /spl mu/m-thick pressure plates were formed by B doped etch-stop technology combined with two-step alkaline etching which enables smooth-surfaced and uniform (2.15/spl plusmn/0.35 (3 /spl sigma/)/spl mu/m) pressure plates. The typical driving voltage is 26.5 V and the SEAJet head has achieved the uniform ink ejection up to a driving frequency of 18 kHz. The life of the actuator has been confirmed to be more than 4 billion times actuation. The typical printing speed of the POS printer is 15 1/s (lines per second) for a rolled paper and 3 ppm (papers per min.) for A4 paper in 360 dpi (dots per inch) high resolution, a performance level that makes this the fastest inkjet POS printer in the world. The average power consumption was measured as only 0.525 mW/nozzle. It is only one-thousandth of that of a typical thermal inkjet.
{"title":"A high resolution, electrostatically-driven commercial inkjet head","authors":"S. Kamisuki, M. Fujii, T. Takekoshi, C. Tezuka, M. Atobe","doi":"10.1109/MEMSYS.2000.838619","DOIUrl":"https://doi.org/10.1109/MEMSYS.2000.838619","url":null,"abstract":"A fully-micromachined, low power, large nozzle count and high resolution \"electrostatically actuated inkjet (SEAJet/sup TM/)\" head has been developed for a POS printer. As 3D multiple-step structured nozzles are required for straight and high frequency ink ejection, it was formed by ICP deep-RIE employing a \"multiple-step mask method\" which makes troublesome stereo-photolithography unnecessary and 128 nozzles/chip were fabricated simultaneously. The required thin, 2 /spl mu/m-thick pressure plates were formed by B doped etch-stop technology combined with two-step alkaline etching which enables smooth-surfaced and uniform (2.15/spl plusmn/0.35 (3 /spl sigma/)/spl mu/m) pressure plates. The typical driving voltage is 26.5 V and the SEAJet head has achieved the uniform ink ejection up to a driving frequency of 18 kHz. The life of the actuator has been confirmed to be more than 4 billion times actuation. The typical printing speed of the POS printer is 15 1/s (lines per second) for a rolled paper and 3 ppm (papers per min.) for A4 paper in 360 dpi (dots per inch) high resolution, a performance level that makes this the fastest inkjet POS printer in the world. The average power consumption was measured as only 0.525 mW/nozzle. It is only one-thousandth of that of a typical thermal inkjet.","PeriodicalId":251857,"journal":{"name":"Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308)","volume":"65 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-01-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126256406","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2000-01-23DOI: 10.1109/MEMSYS.2000.838505
Kwang-Hyun Lee, Hee-Jin Byun, Hyung-Kew Lee, Il-Joo Cho, J. Bu, E. Yoon
This paper reports a new application of micromachined thermally-isolated diaphragm structures for audio frequency filters. We have used a pair of electrothermal elements that consist of a heater and a temperature sensor integrated in the same dielectric diaphragm for a good thermal coupling. The filters using the fabricated electrothermal structures with driving circuitry have been tested. Measured responses of the filters show that a cutoff frequency can be electrically tuned ranging from 30 Hz to 300 Hz. Design parameters with respect to filter characteristics have been analyzed and design guidelines have been identified. The results have demonstrated the possibility that the thermally-isolated diaphragm structures can be used for audio frequency filter applications.
{"title":"An audio frequency filter application of micromachined thermally-isolated diaphragm structures","authors":"Kwang-Hyun Lee, Hee-Jin Byun, Hyung-Kew Lee, Il-Joo Cho, J. Bu, E. Yoon","doi":"10.1109/MEMSYS.2000.838505","DOIUrl":"https://doi.org/10.1109/MEMSYS.2000.838505","url":null,"abstract":"This paper reports a new application of micromachined thermally-isolated diaphragm structures for audio frequency filters. We have used a pair of electrothermal elements that consist of a heater and a temperature sensor integrated in the same dielectric diaphragm for a good thermal coupling. The filters using the fabricated electrothermal structures with driving circuitry have been tested. Measured responses of the filters show that a cutoff frequency can be electrically tuned ranging from 30 Hz to 300 Hz. Design parameters with respect to filter characteristics have been analyzed and design guidelines have been identified. The results have demonstrated the possibility that the thermally-isolated diaphragm structures can be used for audio frequency filter applications.","PeriodicalId":251857,"journal":{"name":"Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308)","volume":"88 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-01-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134116520","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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