Reliability of InP-based HBT's and HEMT's: experiments, failure mechanisms, and statistics

M. Hafizi, M. Delaney
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引用次数: 18

Abstract

InP-based heterojunction bipolar transistors (HBT) an being actively developed For integrated circuit applications requiring high-speed performance. InP HBT is also a low-power technology with a turn-on voltage lower than that of the Si bipolar transistor. The material system is also compatible for optoelectronics integration. The ultimate usefulness of this technology, however, depends on its reliability for system applications. Our extensive experimental data indicates that the reliability performance of millimeterwave InP HBT's meets stringent system requirements such as flight specifications. Another InP-based technology, high-electron mobility transistors (HEMT) have, in the past five years, moved from the research laboratories to insertion in government and commercial electronic systems. For space payload applications of these two technologies we have projected mean-time-to-failures in excess of 10/sup 10/ hours at 45/spl deg/C operating temperature with corresponding activation energies of 1.6 to 1.9 eV. The failure rates are also vanishingly small with dispersions of 0.2 to 0.5 associated with the lognormal failure distribution.<>
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基于inp的HBT和HEMT的可靠性:实验、失效机制和统计
基于inp的异质结双极晶体管(HBT)正被积极开发用于需要高速性能的集成电路应用。InP HBT也是一种低功耗技术,其导通电压低于Si双极晶体管。该材料系统也兼容于光电子集成。然而,这项技术的最终用途取决于它在系统应用中的可靠性。我们的大量实验数据表明,毫米波InP HBT的可靠性性能满足严格的系统要求,如飞行规范。另一种基于inp的技术,高电子迁移率晶体管(HEMT),在过去的五年中,已经从研究实验室转移到政府和商业电子系统中。对于这两种技术的空间有效载荷应用,我们预计在45°C /spl℃的工作温度下,对应的活化能为1.6至1.9 eV,平均故障时间超过10/sup 10/小时。故障率也非常小,离散度为0.2 ~ 0.5,符合对数正态失效分布
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