Applying the universal recovery equation for fast wafer level reliability monitoring NBTI assessment

Abstract

This work demonstrates that NBTI assessment by fast wafer level reliability methods is possible in a quantitative manner. This involves excluding time periods from the stress time that are used for restoration of damage recovered during stress interruption and a calibrated back extrapolation of measured recovery traces to short delay times based on the universal recovery equation. The development of the methodology, the challenges and the verification of the implemented algorithm are presented.