Life-stress relationship for thin film transistor gate line interconnects on flexible substrates

T. Martin, A. Christou
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Abstract

Change in resistance of interconnect traces on flexible substrates is dependent on material properties and mechanical stress imposed by tensile strain. Dedicated test structures and a mechanical flexing / data collection system were designed and fabricated to collect time to failure data based on cyclic loading to different radii of curvature. We propose a life-stress model based on an inverse power law relationship defining the characteristic life of a Weibull life distribution.
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柔性基板上薄膜晶体管栅极线互连的寿命-应力关系
柔性基板上互连线的电阻变化取决于材料性能和拉伸应变施加的机械应力。设计并制造了专用试验结构和机械弯曲数据采集系统,用于采集不同曲率半径循环加载下的失效时间数据。我们提出了一个基于逆幂律关系的寿命-应力模型,该模型定义了威布尔寿命分布的特征寿命。
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