J. Michailos, P. Coudrain, A. Farcy, N. Hotellier, S. Chéramy, S. Lhostis, E. Deloffre, Y. Sanchez, A. Jouve, F. Guyader, E. Saugier, V. Fiori, P. Vivet, M. Vinet, C. Fenouillet-Béranger, F. Casset, P. Batude, F. Breuf, Y. Henrion, B. Vianne, L. Collin, J. Colonna, L. Benaissa, L. Brunet, R. Prieto, R. Vélard, F. Ponthenier
{"title":"New challenges and opportunities for 3D integrations","authors":"J. Michailos, P. Coudrain, A. Farcy, N. Hotellier, S. Chéramy, S. Lhostis, E. Deloffre, Y. Sanchez, A. Jouve, F. Guyader, E. Saugier, V. Fiori, P. Vivet, M. Vinet, C. Fenouillet-Béranger, F. Casset, P. Batude, F. Breuf, Y. Henrion, B. Vianne, L. Collin, J. Colonna, L. Benaissa, L. Brunet, R. Prieto, R. Vélard, F. Ponthenier","doi":"10.1109/IEDM.2015.7409655","DOIUrl":null,"url":null,"abstract":"From low density 3D integrations embedding Via Last Through Silicon Vias (TSV) to high densities hybrid bonding or 3D VSLI CoolCubeTM solutions, a multitude of new product opportunities is now envisioned. An overview of existing emerging 3D integrations is provided covering Image sensors, Photonics, MEMS, Wide I/O memories and Silicon Interposers for advanced logics. Associated key challenges and developments are highlighted focusing on 3D platform performance assessment.","PeriodicalId":336637,"journal":{"name":"2015 IEEE International Electron Devices Meeting (IEDM)","volume":"25 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2015-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"12","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2015 IEEE International Electron Devices Meeting (IEDM)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IEDM.2015.7409655","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 12
Abstract
From low density 3D integrations embedding Via Last Through Silicon Vias (TSV) to high densities hybrid bonding or 3D VSLI CoolCubeTM solutions, a multitude of new product opportunities is now envisioned. An overview of existing emerging 3D integrations is provided covering Image sensors, Photonics, MEMS, Wide I/O memories and Silicon Interposers for advanced logics. Associated key challenges and developments are highlighted focusing on 3D platform performance assessment.
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