Hot carrier aging and its variation under use-bias: Kinetics, prediction, impact on Vdd and SRAM

M. Duan, J. F. Zhang, A. Manut, Z. Ji, W. Zhang, A. Asenov, L. Gerrer, D. Reid, H. Razaidi, D. Vigar, V. Chandra, R. Aitken, B. Kaczer, G. Groeseneken
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引用次数: 17

Abstract

As CMOS scales down, hot carrier aging (HCA) scales up and can be a limiting aging process again. This has motivated re-visiting HCA, but recent works have focused on accelerated HCA by raising stress biases and there is little information on HCA under use-biases. Early works proposed that HCA mechanism under high and low biases are different, questioning if the high-bias data can be used for predicting HCA under use-bias. A key advance of this work is proposing a new methodology for evaluating the HCA-induced variation under use-bias. For the first time, the capability of predicting HCA under use-bias is experimentally verified. The importance of separating RTN from HCA is demonstrated. We point out the HCA measured by the commercial Source-Measure-Unit (SMU) gives erroneous power exponent. The proposed methodology minimizes the number of tests and the model requires only 3 fitting parameters, making it readily implementable.
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热载流子老化及其在使用偏差下的变化:动力学、预测、对Vdd和SRAM的影响
随着CMOS规模的缩小,热载流子老化(HCA)规模扩大,可能再次成为一个极限老化过程。这促使人们重新审视HCA,但最近的研究主要集中在通过提高压力偏差来加速HCA,而关于使用偏差下的HCA的信息很少。早期的研究提出高偏倚和低偏倚下的HCA机制不同,质疑高偏倚数据是否可以用于预测使用偏倚下的HCA。这项工作的一个关键进展是提出了一种新的方法来评估使用偏差下hca诱导的变化。首次通过实验验证了在使用偏差下预测HCA的能力。证明了从HCA中分离RTN的重要性。指出商用SMU (Source-Measure-Unit)测量的HCA给出了错误的功率指数。所提出的方法最大限度地减少了测试次数,模型只需要3个拟合参数,使其易于实现。
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