Interconnect Modeling using a Surface Admittance Operator Derived with the Fokas Method

Dries Bosman, Martijn Huynen, D. De Zutter, Xiao Sun, N. Pantano, G. van der Plas, E. Beyne, D. Ginste
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引用次数: 2

Abstract

In this contribution, we propose a novel approach to rigorously model interconnect structures with an arbitrary convex polygonal cross-section and general, piecewise homogeneous, material parameters. A full-wave boundary integral equation formulation is combined with a differential surface admittance approach, invoking an extended form of the numerically fast Fokas method to construct the pertinent operator. Several examples validate our method and demonstrate its applicability to per-unit-of-length resistance and inductance characterization.
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利用Fokas法导出的表面导纳算子进行互连建模
在这篇贡献中,我们提出了一种新的方法来严格模拟具有任意凸多边形截面和一般的,分段均匀的材料参数的互连结构。将全波边界积分方程公式与微分表面导纳方法相结合,调用数值快速Fokas方法的扩展形式来构造相关算子。几个例子验证了我们的方法,并证明了它对单位长度电阻和电感特性的适用性。
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