Jie Chen, R. Murugan, Sooping Saw, Francisco Lauzurique, J. Broze, Craig Greenberg, Alex Triano, B. Nayak, H. Muniganti, Joe Sivaswamy, D. Gope
{"title":"CISPR 25 Radiated Emission Simulation and Measurement Correlation of an Automotive Reinforced Isolated Switch Driver","authors":"Jie Chen, R. Murugan, Sooping Saw, Francisco Lauzurique, J. Broze, Craig Greenberg, Alex Triano, B. Nayak, H. Muniganti, Joe Sivaswamy, D. Gope","doi":"10.1109/EPEPS53828.2022.9947145","DOIUrl":null,"url":null,"abstract":"Applications of power electronics that integrate high-switching isolated gate drivers in switch mode power converters create excessive transient di/dt and dv/dt loops that exacerbate electromagnetic emissions. In this work, we developed a robust system-level coupled circuit-to-electromagnetic modeling and analysis methodology to predict the CISPR 25 radiated emission performance of a reinforced isolated switch driver during product development. The coupled method accurately captures the electromagnetic interactions between the nonlinear time-variant switchers and the system. Preliminary silicon validation measurements on an automotive high-switching isolated switch driver with an integrated power supply are presented to validate the integrity of the predictive modeling methodology. In an EMC pre-compliance lab, good correlations between modeling and measurements are achieved (i.e., within +/- 3dB for resonant peaks within the frequency band of 30MHz − 1GHz). The predictive EMC modeling methodology can be implemented to assess the performance of the initial silicon design during early IC development.","PeriodicalId":284818,"journal":{"name":"2022 IEEE 31st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)","volume":"9 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-10-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 IEEE 31st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEPS53828.2022.9947145","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
Applications of power electronics that integrate high-switching isolated gate drivers in switch mode power converters create excessive transient di/dt and dv/dt loops that exacerbate electromagnetic emissions. In this work, we developed a robust system-level coupled circuit-to-electromagnetic modeling and analysis methodology to predict the CISPR 25 radiated emission performance of a reinforced isolated switch driver during product development. The coupled method accurately captures the electromagnetic interactions between the nonlinear time-variant switchers and the system. Preliminary silicon validation measurements on an automotive high-switching isolated switch driver with an integrated power supply are presented to validate the integrity of the predictive modeling methodology. In an EMC pre-compliance lab, good correlations between modeling and measurements are achieved (i.e., within +/- 3dB for resonant peaks within the frequency band of 30MHz − 1GHz). The predictive EMC modeling methodology can be implemented to assess the performance of the initial silicon design during early IC development.