Modeling of Hi-Q Embedded Inductors for RF-SOP Applications

Abstract

A new broadband nine-element single-stage model is developed for the high-Q spiral inductor buried into the organic laminate package substrate. The technique utilizes only one RLC resonator incorporated in modified T equivalent circuit to accurate characterize high-frequency effects such as skin, proximate, and fringing effects, and that led to the model more compact. Parameter extraction of model is used analytical all-mathematical formulations to evaluate frequency-independent elements. This enables the modeling procedure effectively integrated in SPICE-compatible simulators feasible and facile for efficient design of RFIC modules. The proposed model has been verified using embedded inductor in a 4-layer BT laminate, one of today's most popular package substrate. Good agreement between measurements and modeling results over the whole interesting frequency regime has been shown to demonstrate the validity of proposed method