Evolutionary business models and inter-firm engineering processes between the foundry and fabless in the semiconductor industry

R. Guo, Y. Su, Su-fen Chiu, Fan-Yun Pai, Chung-Pin Yeh
{"title":"Evolutionary business models and inter-firm engineering processes between the foundry and fabless in the semiconductor industry","authors":"R. Guo, Y. Su, Su-fen Chiu, Fan-Yun Pai, Chung-Pin Yeh","doi":"10.1109/ISSM.2007.4446820","DOIUrl":null,"url":null,"abstract":"The goals of this paper are to explore the evolutionary business models between the foundry and fabless and the inter-firm engineering processes. By conducting field interviews and empirical study, this research summarizes three phases of inter-firm business models which include: transaction-based, partnership-based, and collaboration-based relationship. In the third phase, the participating partners include not only the foundry/fabless players but also the third-party suppliers such as EDA vendors, IP providers and design service providers. The transaction targets are exchanged mainly to gain \"complementary assets\" so that each player can reduce its investment and development risks. To reduce the \"transaction costs\" within this alliance, these players need seamless collaboration processes and effective inter-firm engineering processes. Service management from the foundry side is also described using a generic framework and some business implications are provided.","PeriodicalId":325607,"journal":{"name":"2007 International Symposium on Semiconductor Manufacturing","volume":"34 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2007-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2007 International Symposium on Semiconductor Manufacturing","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISSM.2007.4446820","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 3

Abstract

The goals of this paper are to explore the evolutionary business models between the foundry and fabless and the inter-firm engineering processes. By conducting field interviews and empirical study, this research summarizes three phases of inter-firm business models which include: transaction-based, partnership-based, and collaboration-based relationship. In the third phase, the participating partners include not only the foundry/fabless players but also the third-party suppliers such as EDA vendors, IP providers and design service providers. The transaction targets are exchanged mainly to gain "complementary assets" so that each player can reduce its investment and development risks. To reduce the "transaction costs" within this alliance, these players need seamless collaboration processes and effective inter-firm engineering processes. Service management from the foundry side is also described using a generic framework and some business implications are provided.
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半导体工业中代工厂与无晶圆厂之间的演化商业模式与企业间工程流程
本文的目的是探讨代工厂和无晶圆厂之间的演化商业模式和企业间的工程流程。通过实地访谈和实证研究,本研究总结出企业间商业模式的三个阶段:基于交易的、基于伙伴关系的和基于协作的关系。在第三阶段,参与的合作伙伴不仅包括代工/无晶圆厂厂商,还包括EDA供应商、IP提供商和设计服务提供商等第三方供应商。交易标的的交换主要是为了获得“互补资产”,从而降低各方的投资开发风险。为了降低联盟中的“交易成本”,这些参与者需要无缝的协作流程和有效的公司间工程流程。还使用通用框架描述了铸造端服务管理,并提供了一些业务含义。
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