Diamond based metal-semiconductor contacts for elevated temperatures

H. Fecht, C. Ettl, M. Werner
{"title":"Diamond based metal-semiconductor contacts for elevated temperatures","authors":"H. Fecht, C. Ettl, M. Werner","doi":"10.1109/HTEMDS.1998.730693","DOIUrl":null,"url":null,"abstract":"Microsystems technology allows the integration of several functions within one product. The tendency towards continous miniaturization and the corresponding increase in integration density is a further challenge to the materials in use, in particular at elevated temperatures. For high temperature applications, wide bandgap semiconductors, such as diamond, are used. Several materials related properties are discussed, in particular for the manufacture of stable contacts.","PeriodicalId":197749,"journal":{"name":"1998 High-Temperature Electronic Materials, Devices and Sensors Conference (Cat. No.98EX132)","volume":"38 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1998-02-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"1998 High-Temperature Electronic Materials, Devices and Sensors Conference (Cat. No.98EX132)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/HTEMDS.1998.730693","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

Abstract

Microsystems technology allows the integration of several functions within one product. The tendency towards continous miniaturization and the corresponding increase in integration density is a further challenge to the materials in use, in particular at elevated temperatures. For high temperature applications, wide bandgap semiconductors, such as diamond, are used. Several materials related properties are discussed, in particular for the manufacture of stable contacts.
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
高温用金刚石基金属半导体触点
微系统技术允许在一个产品中集成多个功能。不断小型化的趋势和相应的集成密度的增加是对使用中的材料的进一步挑战,特别是在高温下。对于高温应用,使用宽带隙半导体,如金刚石。讨论了几种材料的相关性能,特别是稳定触点的制造。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Long term behavior of passive components for high temperature applications-an update High temperature performance of hybrid GaN/SiC high power diodes Materials selection issues for high operating temperature (HOT) electronic packaging High temperature stable metallization schemes for SiC-technology operating in air Diamond based metal-semiconductor contacts for elevated temperatures
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1