Sunil Rathore, Rajeewa Kumar Jaisawal, P. Kondekar, N. Gandhi, Shashank Banchhor, Young Suh Song, N. Bagga
{"title":"Self-Heating Aware Threshold Voltage Modulation Conforming to Process and Ambient Temperature Variation for Reliable Nanosheet FET","authors":"Sunil Rathore, Rajeewa Kumar Jaisawal, P. Kondekar, N. Gandhi, Shashank Banchhor, Young Suh Song, N. Bagga","doi":"10.1109/IRPS48203.2023.10117918","DOIUrl":null,"url":null,"abstract":"Internal and external process variations severely affect the device threshold voltage $(\\mathrm{V}_{\\text{th}})$ and, in turn, the device's reliability. For the first time, this paper presented a thorough analysis of the self-heating aware $\\mathrm{V}_{\\text{th}}$ variation of a Nanosheet FET and, thus, the device's aging. Using well-calibrated TCAD models, we evaluated the 'change in $V_{th}\\ ^{\\prime}$ and performed an extensive design space exploration to analyze: (i) the impact of work function (WF) modulation owing to metal grain sizes and effective grains (for confined dimensions) on $\\mathrm{V}_{\\text{th}}$ variation; (ii) the impact of ambient temperature (TA) on $\\mathrm{V}_{\\text{th}}$ variation; (iii) the influence of trap charges on device characteristics; (iv) how the consideration of RDF impacted $\\mathrm{V}_{\\text{th}};$ (v) the device's aging, i.e., end of a lifetime (EOL). These investigations provided guidelines for designing a reliable Nanosheet FET (NSFET) to investigate and mitigate early aging.","PeriodicalId":159030,"journal":{"name":"2023 IEEE International Reliability Physics Symposium (IRPS)","volume":"16 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2023-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2023 IEEE International Reliability Physics Symposium (IRPS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IRPS48203.2023.10117918","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
Internal and external process variations severely affect the device threshold voltage $(\mathrm{V}_{\text{th}})$ and, in turn, the device's reliability. For the first time, this paper presented a thorough analysis of the self-heating aware $\mathrm{V}_{\text{th}}$ variation of a Nanosheet FET and, thus, the device's aging. Using well-calibrated TCAD models, we evaluated the 'change in $V_{th}\ ^{\prime}$ and performed an extensive design space exploration to analyze: (i) the impact of work function (WF) modulation owing to metal grain sizes and effective grains (for confined dimensions) on $\mathrm{V}_{\text{th}}$ variation; (ii) the impact of ambient temperature (TA) on $\mathrm{V}_{\text{th}}$ variation; (iii) the influence of trap charges on device characteristics; (iv) how the consideration of RDF impacted $\mathrm{V}_{\text{th}};$ (v) the device's aging, i.e., end of a lifetime (EOL). These investigations provided guidelines for designing a reliable Nanosheet FET (NSFET) to investigate and mitigate early aging.