Nondestructive high resolution resistivity topography of Semi-insulating GaAs and InP wafers

W. Jantz, R. Stibal, J. Windscheif, F. Mosel, G. Muller
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引用次数: 1

Abstract

The capacitive charge transient measurement technique generates laterally resolved two-dimensional resistivity topograms of wafers with diameters up to 150 mm. The method is applicable to semi-insulating substrates with resistivities between 10/sup 6/ and 10/sup 9//spl Omega/cm. The range and characteristic lateral patterns of homogeneity variations in substrates of different vendors will be addressed, including LEC GaAs, VB GaAs and LEC InP. The effect of annealing treatments and interrelations between electrical and optical topograms will also be discussed.
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半绝缘GaAs和InP晶圆的无损高分辨电阻率形貌
电容电荷瞬态测量技术可生成直径达150mm的晶圆的横向分辨二维电阻率形貌图。该方法适用于电阻率在10/sup 6/和10/sup 9//spl ω /cm之间的半绝缘衬底。将讨论不同供应商衬底的同质性变化的范围和特征横向模式,包括LEC GaAs, VB GaAs和LEC InP。退火处理的影响以及电学和光学形貌之间的相互关系也将被讨论。
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