Physics and behavior of asymmetrically recessed InP-based MODFET's fabricated with an electron beam resist process

D.G. Ballegeer, I. Adesida, C. Caneau, R. Bhat
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引用次数: 7

Abstract

Despite their superior high frequency performance, InAlAs/InGaAs modulation-doped field effect transistors (MODFETs) consistently exhibit high output conductances and low gain-to-drain breakdown voltages. Two main cap designs have been used when fabricating these devices to improve these characteristics. The first design is the use of an undoped or depleted cap which has the adverse effect of increasing both the drain and the source resistances. In order to preserve the high frequency characteristic of these devices, an alternate design, often called a "double-recess" design, may be used. This design features a wide recess trench in a doped cap which extends farther on the drain side of the gate than on the source side and is therefore asymmetric about the gate. This has the advantage of preserving a low source resistance while increasing the drain resistance to the desired value. However, this design often requires a separate lithography step to define the asymmetric recess trench. Previously, a unique electron beam process was developed and presented which is to date the only reported process which enables both the asymmetric recess to be made and a submicron T-shaped gate to be metallized in a single lithography step. The process, which utilizes multiple layers of electron beam resist, allows a great deal of control of the extent of the cap recess on the drain side of the gate without the need for an alignment between two separate lithography steps. In this paper, MODFETs are fabricated on OMVPE-grown InAlAs/InGaAs structure both with and without the use of this electron beam resist process in order to investigate the effects of asymmetric recess on device performance. The DC and high frequency characteristics of these devices are reported as a function of the extent of the gate recess toward the drain. Values for the small-signal equivalent circuit model elements extracted from high frequency S-parameter measurements are also presented.<>
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电子束抗蚀剂制备非对称凹槽inp基MODFET的物理特性和性能
尽管具有优异的高频性能,InAlAs/InGaAs调制掺杂场效应晶体管(modfet)始终表现出高输出电导和低增益-漏极击穿电压。在制造这些装置时,使用了两种主要的帽设计来改善这些特性。第一种设计是使用未掺杂或耗尽的帽,这会增加漏极和源极电阻的不利影响。为了保持这些器件的高频特性,可以使用另一种设计,通常称为“双凹槽”设计。这种设计的特点是在掺杂帽中有一个宽的凹槽沟槽,它在栅极的漏极侧比源极侧延伸得更远,因此在栅极上是不对称的。这样做的优点是在保持低源电阻的同时将漏极电阻增加到所需值。然而,这种设计通常需要单独的光刻步骤来定义不对称凹槽沟槽。此前,一种独特的电子束工艺被开发并提出,这是迄今为止唯一报道的工艺,可以在单个光刻步骤中制造不对称凹槽和亚微米t形栅极。该工艺利用多层电子束抗蚀剂,可以对栅极漏极侧的凹槽进行大量控制,而无需在两个单独的光刻步骤之间进行校准。本文分别在omvpe生长的InAlAs/InGaAs结构上制备了modfet,研究了不对称凹槽对器件性能的影响。据报道,这些器件的直流和高频特性是栅极凹槽向漏极方向延伸的函数。给出了从高频s参数测量中提取的小信号等效电路模型元件的值。
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Comparisons between conventional LEC, VCZ and VGF for the growth of InP crystals Reliability of InP-based HBT's and HEMT's: experiments, failure mechanisms, and statistics Bulk InP technologies: InP against GaAs Improvement of InAlAs/InP heterointerface grown by MOVPE by using thin AlP layer Low pressure pyrolysis of alternative phosphorous precursors for chemical beam epitaxial growth of InP and related compounds
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