Y. Ogawa, H. Nagashima, Y. Yoshimizu, H. Tomita, T. Kishimoto, K. Miya, A. Izumi
{"title":"Fine edge and bevel film stripping process by novel wet cleaning tool beyond 45nm node","authors":"Y. Ogawa, H. Nagashima, Y. Yoshimizu, H. Tomita, T. Kishimoto, K. Miya, A. Izumi","doi":"10.1109/ISSM.2007.4446885","DOIUrl":null,"url":null,"abstract":"In this paper, we indicate the difficulty of high-k film stripping of edge cut area using conventional bevel and backside etching tool and propose a fine edge cut control process using a novel bevel and backside etching tool with edge dispense nozzles.","PeriodicalId":325607,"journal":{"name":"2007 International Symposium on Semiconductor Manufacturing","volume":"24 9","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2007-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2007 International Symposium on Semiconductor Manufacturing","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISSM.2007.4446885","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2
Abstract
In this paper, we indicate the difficulty of high-k film stripping of edge cut area using conventional bevel and backside etching tool and propose a fine edge cut control process using a novel bevel and backside etching tool with edge dispense nozzles.