Impact of buffer leakage on intrinsic reliability of 650V AlGaN/GaN HEMTs

P. Moens, A. Banerjee, M. Uren, M. Meneghini, S. Karboyan, I. Chatterjee, P. Vanmeerbeek, M. Casar, C. Liu, A. Salih, E. Zanoni, G. Meneghesso, Martin Kuball, M. Tack
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引用次数: 73

Abstract

The role of buffer traps (identified as CN acceptors through current DLTS) in the off-state leakage and dynamic Ron of 650V rated GaN-on-Si power devices is investigated. The dynamic Ron is strongly voltage-dependent, due to the interplay between the dynamic properties of the CN traps and the presence of space-charge limited current components. This results in a complete suppression of dyn Ron degradation under HTRB conditions between 420V and 850V.
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缓冲泄漏对650V AlGaN/GaN hemt固有可靠性的影响
研究了缓冲陷阱(通过电流dlt识别为CN受体)在650V额定GaN-on-Si功率器件的失态泄漏和动态损耗中的作用。由于CN陷阱的动态特性和空间电荷限制电流分量之间的相互作用,动态Ron具有很强的电压依赖性。这导致在420V和850V之间的HTRB条件下完全抑制dyn Ron降解。
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