High soft-error tolerance body-tied SOI technology with partial trench isolation (PTI) for next generation devices

Abstract

It was proven that the body-tied SOI technology with partial trench isolation (PTI) has significant high soft-error immunity. As compared with the bulk, a three-order reduction of the soft-error rate for a 0.18 /spl mu/m SOI 4 Mbit SRAM with the PTI was successfully realized by the balanced combination of the SOI thickness and well resistance. It is estimated that the soft-error immunity for the floating-body device degrades because large charge collection is induced by not only the body strike but also the drain strike. A design guideline of the SOI structure to suppress soft errors is presented. According to the guideline, beyond 0.13 /spl mu/m node, high soft-error immunity for the body-tied SOI device was projected as compared with the bulk as well as the body-floating SOI device.