Real-time observation of trap generation by scanning tunneling microscopy and the correlation to high-κ gate stack breakdown

Y. C. Ong, D. Ang, K. Pey, S. O’Shea, K. Kakushima, T. Kawanago, H. Iwai, C. Tung
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Abstract

Evolution of electronic trap generation in the highdielectric constant (Hκ) layer and the interfacial layer (IL) of the Hκ gate stack and their interdependency is examined at nanoscopic resolution using scanning tunnelling microscopy (STM). We observed experimentally (i) trap generation in the dielectric layer next to the cathode is generally mismatched with pre-existing traps in the IL which exhibit stress induced leakage current (SILC) characteristics. (ii) Pre-existing SILC trap can evolve into a percolation path within the dielectric layer. (iii) pre-existing leakage path in the Hκ can accelerate trap generation in the IL due to electric field enhancement. Based on the experimental insight, a model on how BD of the Hκ gate stack is triggered by traps in the Hκ and IL layers is proposed.
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扫描隧道显微镜实时观察陷阱产生及其与高κ栅极堆叠击穿的关系
利用扫描隧道显微镜(STM)在纳米分辨率下研究了高介电常数(Hκ)层和Hκ栅极堆栈界面层(IL)中电子陷阱生成的演变及其相互依赖性。我们在实验中观察到(1)阴极旁边的介电层中产生的陷阱通常与IL中已有的陷阱不匹配,这些陷阱表现出应力诱发漏电流(SILC)特征。(ii)预先存在的硅碳阱可以演变成介电层内的渗透路径。(iii)由于电场增强,Hκ中预先存在的漏通路可以加速IL中陷阱的产生。基于实验的见解,提出了一个关于Hκ和IL层中的陷阱如何触发Hκ门堆栈的BD的模型。
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