A. Tixier, Y. Mita, S. Oshima, Jiang Guoy, H. Fujita
{"title":"3-D microsystem packaging for interconnecting electrical, optical and mechanical microdevices to the external world","authors":"A. Tixier, Y. Mita, S. Oshima, Jiang Guoy, H. Fujita","doi":"10.1109/MEMSYS.2000.838603","DOIUrl":null,"url":null,"abstract":"This paper reports the realization of a pigtailed silicon platform with 8 WDM filters based on a new 3-D packaging technology. Four silicon pieces are released out of a silicon wafer by using ICP-RIE as a very accurate dicing tool. One edge of the piece containing the filters is patterned into pin-shapes to be vertically inserted into a mother board with electrical connections. A V-groove board for the optical fibers is mechanically aligned in the mother board. This technology enables precise assembly of active optical devices with ribbon fibers, electrical connections to 3-D micromechanical subsystems and reconfiguring the system in the module level.","PeriodicalId":251857,"journal":{"name":"Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308)","volume":"48 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2000-01-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"8","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MEMSYS.2000.838603","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 8
Abstract
This paper reports the realization of a pigtailed silicon platform with 8 WDM filters based on a new 3-D packaging technology. Four silicon pieces are released out of a silicon wafer by using ICP-RIE as a very accurate dicing tool. One edge of the piece containing the filters is patterned into pin-shapes to be vertically inserted into a mother board with electrical connections. A V-groove board for the optical fibers is mechanically aligned in the mother board. This technology enables precise assembly of active optical devices with ribbon fibers, electrical connections to 3-D micromechanical subsystems and reconfiguring the system in the module level.