Development and Product Reliability Characterization of Advanced High Speed 14nm DDR5 DRAM with On-die ECC

S. Lee, Nam-Hee Lee, K. W. Lee, J. H. Kim, J. Jin, Y. S. Lee, Y. Hwang, H. S. Kim, S. Pae
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Abstract

The reliability characterization of fabricated 14nm DDR5 DRAMs with On-die Error Correction Code (ECC) and EUV process is presented for the first time. Intrinsic reliability of FEOL and BEOL WLR showed well above 10yrs of lifetime, 125°C. The products demonstrated no fails in high temperature operating lifetime (HTOL) of 1000hrs. The On-Die ECC design improved the single bit error rate by $\boldsymbol{10^{-6}}$ times (refresh time $\boldsymbol{ > 4\mathrm{x}}$). The failure rate, ppm of manufacturing burn-in process confirmed the healthiness of the baseline material and also effectively screen out and monitor any random defects. The presented 14nm DDR5 DRAMs are well in production for the PC segments and have been shipping and qualified for the Server segments.
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带有片上 ECC 的先进高速 14 纳米 DDR5 DRAM 的开发和产品可靠性鉴定
首次介绍了采用片上纠错码 (ECC) 和 EUV 工艺制造的 14 纳米 DDR5 DRAM 的可靠性特性。在 125°C 温度条件下,FEOL 和 BEOL WLR 的内在可靠性远高于 10 年寿命。产品在 1000 小时的高温工作寿命(HTOL)中未出现故障。片上 ECC 设计将单比特错误率提高了 $\boldsymbol{10^{-6}}$ 倍(刷新时间 $\boldsymbol{ > 4\mathrm{x}}$ )。故障率、生产烧制过程的 ppm 值证实了基线材料的健康状况,同时也有效地筛查和监控了任何随机缺陷。所展示的 14nm DDR5 DRAM 在个人电脑领域已投入生产,在服务器领域也已出货并通过了认证。
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