R. van Dalen, H. P. Tuinhout, M. Stoutjesdijk, J. van Zwol, J. J. M. Zaal, J. H. J. Janssen, F. H. M. Swartjes, P. A. M. Bastiaansen, M. C. Lammers, L. Brusamarello, M. Stekelenburg
{"title":"A methodology to predict the impact of wafer level chip scale package stress on high-precision circuits","authors":"R. van Dalen, H. P. Tuinhout, M. Stoutjesdijk, J. van Zwol, J. J. M. Zaal, J. H. J. Janssen, F. H. M. Swartjes, P. A. M. Bastiaansen, M. C. Lammers, L. Brusamarello, M. Stekelenburg","doi":"10.1109/IEDM.2015.7409646","DOIUrl":null,"url":null,"abstract":"A methodology is presented that allows quantitative prediction of the impact of WLCSP induced mechanical stress on high precision mixed-signal ICs. The simulation flow was tuned using high-resolution experimental variability data measured on dedicated test chips. The methodology is exemplified with an on-chip oscillator circuit suffering from WLCSP stress induced variability.","PeriodicalId":336637,"journal":{"name":"2015 IEEE International Electron Devices Meeting (IEDM)","volume":"68 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2015-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"9","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2015 IEEE International Electron Devices Meeting (IEDM)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IEDM.2015.7409646","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 9
Abstract
A methodology is presented that allows quantitative prediction of the impact of WLCSP induced mechanical stress on high precision mixed-signal ICs. The simulation flow was tuned using high-resolution experimental variability data measured on dedicated test chips. The methodology is exemplified with an on-chip oscillator circuit suffering from WLCSP stress induced variability.
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