S. Brongersma, K. Vanstreels, W. Wu, W. Zhang, D. Ernur, J. D’Haen, V. Terzieva, M. Van Hove, T. Clarysse, L. Carbonell, W. Vandervorst, W. De Ceuninck, K. Maex
{"title":"Copper grain growth in reduced dimensions","authors":"S. Brongersma, K. Vanstreels, W. Wu, W. Zhang, D. Ernur, J. D’Haen, V. Terzieva, M. Van Hove, T. Clarysse, L. Carbonell, W. Vandervorst, W. De Ceuninck, K. Maex","doi":"10.1109/IITC.2004.1345680","DOIUrl":null,"url":null,"abstract":"The size effect observed for copper in reduced dimensions is studied by several different routes in order to further understand the relative influence of various scattering mechanisms and determine where to focus our efforts in order to reduce line resistance.","PeriodicalId":148010,"journal":{"name":"Proceedings of the IEEE 2004 International Interconnect Technology Conference (IEEE Cat. No.04TH8729)","volume":"53 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2004-06-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the IEEE 2004 International Interconnect Technology Conference (IEEE Cat. No.04TH8729)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IITC.2004.1345680","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 3
Abstract
The size effect observed for copper in reduced dimensions is studied by several different routes in order to further understand the relative influence of various scattering mechanisms and determine where to focus our efforts in order to reduce line resistance.
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