Girish Dixit, Lester A. D'Cruz, Sang-Wook Ahn, Yi Zheng, Josephine J. Chang, M. Naik, Alexandros T. Demos, D. Witty, Hichem M'Saad
{"title":"Film properties and integration performance of a nano-porous carbon doped oxide","authors":"Girish Dixit, Lester A. D'Cruz, Sang-Wook Ahn, Yi Zheng, Josephine J. Chang, M. Naik, Alexandros T. Demos, D. Witty, Hichem M'Saad","doi":"10.1109/IITC.2004.1345720","DOIUrl":null,"url":null,"abstract":"A porous carbon doped oxide has been developed using a conventional PECVD reactor. Sequential electron beam treatment using a flood beam provides a means for removal of the thermally labile organic species and results in a porous material with high thermal stability. Film properties and integration results presented show the viability of integrating this film into a conventional dual damascene interconnect flow.","PeriodicalId":148010,"journal":{"name":"Proceedings of the IEEE 2004 International Interconnect Technology Conference (IEEE Cat. No.04TH8729)","volume":"3 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2004-06-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the IEEE 2004 International Interconnect Technology Conference (IEEE Cat. No.04TH8729)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IITC.2004.1345720","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2
Abstract
A porous carbon doped oxide has been developed using a conventional PECVD reactor. Sequential electron beam treatment using a flood beam provides a means for removal of the thermally labile organic species and results in a porous material with high thermal stability. Film properties and integration results presented show the viability of integrating this film into a conventional dual damascene interconnect flow.
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