Optimal implementation of sea of leads (SoL) compliant interconnect technology

Abstract

Compliant interconnects can enable wafer level packages with high I/O density, high reliability and better performances with low cost and small size. A fabrication process for SoL compliant interconnects has been optimized to achieve high yield and compatibility with standard back-end-of-line (BEOL) as well as flip-chip bonding processes. The optimized fabrication process further enables a reliable joining between the IC and SoL compliant interconnects to the next level of packaging without the use of an expensive underfilling process.