Design trade-offs in InP based HBT ICs

R. Montgomery, J. Jensen
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Abstract

The authors describe the current state of the art results and highlight design tradeoffs encountered for applications in analog, digital, and microwave circuits using InP based heterojunction bipolar transistors (HBTs). InP based HBTs are not merely devices for application in optoelectronic integrated circuits (OEICs). While the OEIC efforts continue, interest is increasing in very high performance systems for analog, digital, and power microwave applications. In the last year, significant improvements in device performance have been accomplished by grading the emitter-base junction and modifying the collector to enhance the breakdown performance. Issues of reliability are now getting attention and the technology is being applied more widely.<>
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基于InP的HBT集成电路的设计权衡
作者描述了目前最先进的结果,并强调了使用基于InP的异质结双极晶体管(hbt)在模拟、数字和微波电路中应用所遇到的设计权衡。基于InP的hbt不仅是光电集成电路(oeic)中的应用器件。在OEIC继续努力的同时,对模拟、数字和功率微波应用的高性能系统的兴趣也在增加。去年,通过对发射极-基极结进行分级和修改集电极以提高击穿性能,器件性能得到了显著改善。可靠性问题正在引起人们的注意,这项技术正在得到更广泛的应用。
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Normal incidence intersubband absorption in InGaAs quantum wells Interdiffusion of InGaAs/InGaAsP quantum wells GaInP/GaAs HBTs for microwave applications First fabrication of continuously graded InGaAsP on GaAs for 0.98/spl mu/m lasers Improved breakdown-speed tradeoff of InP/InGaAs single heterojunction bipolar transistor using a novel p/sup -/-n/sup -/ collector structure
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