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1993 (5th) International Conference on Indium Phosphide and Related Materials最新文献

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Carbon-doped p-type In/sub 0.53/Ga/sub 0.47/As and its application to InP/In/sub 0.53/Ga/sub 0.47/As heterojunction bipolar transistors 掺碳p型In/sub 0.53/Ga/sub 0.47/As及其在InP/In/sub 0.53/Ga/sub 0.47/As异质结双极晶体管中的应用
Pub Date : 1993-04-19 DOI: 10.1109/ICIPRM.1993.380549
C. Tu
P-type carbon-doped In/sub 0.53/Ga/sub 0.47/As grown by various epitaxial techniques is reviewed. High hole concentrations in In/sub 0.53/Ga/sub 0.47/As can be achieved by using CCl/sub 4/ or CBr/sub 4/ as the carbon doping source. The highest hole concentration so far is 9 /spl times/ 10/sup 19/ cm/sup -3/ by gas-source molecular beam epitaxy with CBr/sub 4/. Results of InP/In/sub 0.53/Ga/sub 0.47/A single and double heterojunction bipolar transistors are summarized.<>
综述了各种外延技术生长p型掺杂碳的In/sub 0.53/Ga/sub 0.47/As。采用CCl/sub - 4/或CBr/sub - 4/作为碳掺杂源,可以在in /sub - 0.53/Ga/sub - 0.47/As中获得较高的空穴浓度。用CBr/sub / 4/气源分子束外延可获得9/ spl倍/ 10/sup 19/ cm/sup -3/的最高空穴浓度。总结了InP/In/sub 0.53/Ga/sub 0.47/A单、双异质结双极晶体管的研究结果。
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引用次数: 1
Semi-insulating InP:Fe grown on Si 生长在Si上的半绝缘InP:Fe
Pub Date : 1993-04-19 DOI: 10.1109/ICIPRM.1993.380696
R. Schnabel, F. Heinrichsdorff, A. Krost, M. Grundmann, T. Wolf, K. Schatke, D. Bimberg, M. Pilatzek, P. Harde
Metal organic chemical vapor deposition of undoped and Fe-doped InP on vicinal Si[001] and Si(111) is reported. Semi-insulating InP on Si(111) with a resistivity of 3 /spl times/ 10/sup 7/ /spl Omega/cm has been made for the first time. The resistivity increases with decreasing defect density in the InP:Fe epitaxial layers. In InP/Si(111), a considerable reduction of crystal defects by one order of magnitude was found as compared to InP/Si[001]. In consequence, the undesired defect induced effects of strong Si incorporation and incorporation of electrically inactive Fe are almost suppressed.<>
报道了未掺杂和掺铁InP在相邻Si[001]和Si(111)上的金属有机化学气相沉积。首次制成了电阻率为3 /spl × / 10/sup / 7/ spl ω /cm的半绝缘InP on Si(111)。在InP:Fe外延层中,电阻率随缺陷密度的减小而增大。在InP/Si(111)中,与InP/Si相比,晶体缺陷显著减少了一个数量级[001]。因此,强Si掺入和非电活性Fe掺入所引起的缺陷效应几乎被抑制
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引用次数: 0
High power novel heterojunction JFETs (HJFETs) grown by MOCVD 采用MOCVD法生长高功率新型异质结jfet
Pub Date : 1993-04-19 DOI: 10.1109/ICIPRM.1993.380631
M. Hashemi, J. Shealy, S. Denbaars, U. Mishra
The authors report the power performance of a novel InP junction field-effect transistor (JFET) with a p/sup +/-GaInAs heterostructure gate (HJFET). The HJFET structure was grown by non-hydride metal-organic chemical vapor deposition (MOCVD) at atmospheric pressure and at a substrate temperature of 560/spl deg/C using tertiarybutylphosphine, tertiarybutylarsine as the alternative sources for phosphine and arsine, respectively. p/sup +/ GaInAs was used as the gate material, and n InP as the channel. It is shown that both epitaxial layer design, and device geometry play an important role in device performance. HJFETs with superior performance, an easier fabrication process, and scalability to sub-micron gate lengths compared to homojunction JFETs have been demonstrated.<>
本文报道了一种新型的p/sup +/-GaInAs异质结构栅极(HJFET) InP结场效应晶体管(JFET)的功率性能。采用非氢化物金属-有机化学气相沉积法(MOCVD)在常压和560℃的衬底温度下生长HJFET结构,分别以叔丁基膦和叔丁基larsin作为磷化氢和arsin的替代源。采用p/sup +/ GaInAs作为栅极材料,n InP作为通道。结果表明,外延层设计和器件几何形状对器件性能都有重要影响。与同质结jfet相比,hjfet具有优异的性能、更简单的制造工艺和亚微米栅极长度的可扩展性
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引用次数: 0
Monolithic integration of lasers and bipolar transistors by selective area epitaxy 用选择性区域外延实现激光器和双极晶体管的单片集成
Pub Date : 1993-04-19 DOI: 10.1109/ICIPRM.1993.380656
X. An, H. Temkin, A. Feygenson, R. Hamm, M. Cotta, R. Logan, D. Coblentz
The authors describe the use of selective area epitaxy to prepare monolithically integrated lasers and heterostructure bipolar transistors (HBTs) based on InGaAs(P)/InP. The laser is a capped mesa buried heterostructure structure grown by metal-organic chemical vapor deposition (MOCVD) and optimized for fiber communications. The HBT structures were grown by metal-organic molecular beam epitaxy (MOMBE) on the semi-insulating current confining layers of the lasers. The quality of selectively grown HBTs is illustrated in the Gummel plot and common emitter output characteristics. The DC performance of an integrated structure is illustrated. The laser is driven with the collector current of the HBT. Threshold is achieved at a base current of I/sub B/=360 /spl mu/A. Light output of the laser is linear to at least 10 mW. Preliminary experiments show the bandwidth of the integrated device to be in excess of 3 GHz.<>
作者描述了利用选择性区域外延制备基于InGaAs(P)/InP的单片集成激光器和异质结构双极晶体管(HBTs)。该激光器采用金属有机化学气相沉积(MOCVD)技术制备,是一种针对光纤通信进行优化的覆盖台面埋没异质结构激光器。利用金属-有机分子束外延(MOMBE)技术在激光器的半绝缘电流限制层上生长HBT结构。在Gummel图和共发射极输出特性中说明了选择性生长的HBTs的质量。说明了集成结构的直流性能。激光器由HBT的集电极电流驱动。阈值在I/sub /=360 /spl mu/ a的基极电流下实现。激光器的光输出至少为10mw,呈线性。初步实验表明,集成器件的带宽超过3ghz。
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引用次数: 0
Transport of electrons in the near-surface region of InP InP近表面区域的电子输运
Pub Date : 1993-04-19 DOI: 10.1109/ICIPRM.1993.380630
Z. Zou, D. Lile
Summary form only given. To study surface-related scattering mechanisms in InP the authors have fabricated and characterized enhancement mode metal-insulator-semiconductor FETs (MISFETs) on commercially available SI material as well as accumulation mode devices on n-type gas source molecular beam epitaxy grown epitaxial n-type material. In all cases the gate insulator was SiO/sub 2/ deposited by low-pressure, indirect plasma enhanced chemical vapor deposition over the temperature range from /spl sim/175 to 275K. Experimental results obtained on both types of FET have included field effect and effective mobility values measured as a function of channel carrier density and temperature, over the range from /spl sim/77 to 300 K, and as a function of dielectric growth temperature. To elucidate the dominant scattering mechanisms in these devices, the surface transport was modeled by including, in addition to the standard bulk scattering processes, the effects of surface roughness, interfacial charge, and neutral surface impurity scattering. The results of surface mobility studies are presented, including the fitting of the experimental mobility data to the theory.<>
只提供摘要形式。为了研究InP中与表面相关的散射机制,作者在市售SI材料上制备了增强模式金属-绝缘体-半导体场效应管(misfet)并对其进行了表征,同时在n型气体源分子束外延生长的n型外延材料上制备了积累模式器件。在所有情况下,栅极绝缘体都是通过低压,间接等离子体增强化学气相沉积在/spl sim/175到275K的温度范围内沉积的SiO/sub 2/。在这两种类型的场效应管上获得的实验结果包括场效应和有效迁移率值作为通道载流子密度和温度的函数,在/spl sim/77到300 K的范围内,以及作为介电生长温度的函数。为了阐明这些器件的主要散射机制,除了标准的体散射过程外,还包括表面粗糙度、界面电荷和中性表面杂质散射的影响,对表面输运进行了建模。给出了表面迁移率研究的结果,包括实验迁移率数据与理论的拟合
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引用次数: 0
The role of InP technology in the optical fibre communications of the future InP技术在未来光纤通信中的作用
Pub Date : 1993-04-19 DOI: 10.1109/ICIPRM.1993.380723
A. Hadjifotiou
Summary form only given. The author summarizes briefly the current network requirements and outlines the characteristics of the InP devices that are used. Secondly the future information requirements and possible broadband network configurations suitable for time or wavelength division multiplexing are introduced and their requirements and possible broadband network configurations suitable for time or wavelength division multiplexing are introduced and their requirements in terms of devices are analyzed. The focus is on InP devices that can satisfy the system requirements. Five critical areas where InP technology can be used with substantial advantages for future communications are reviewed. An outline of the RACE program is given that is addressing the basic technology and device design problems of the InP technology.<>
只提供摘要形式。作者简要总结了当前的网络需求,并概述了所使用的InP设备的特点。其次,介绍了未来的信息需求和可能的时分或波分复用宽带网络配置,介绍了它们的需求和可能的时分或波分复用宽带网络配置,并分析了它们在设备方面的需求。重点是能够满足系统需求的InP设备。审查了在未来通信中使用InP技术具有实质性优势的五个关键领域。RACE计划的大纲给出了解决InP技术的基本技术和器件设计问题。
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引用次数: 1
High quality long wavelength lasers grown by atmospheric pressure MOCVD with liquid group V sources 用V族液体源常压MOCVD制备高质量长波激光器
Pub Date : 1993-04-19 DOI: 10.1109/ICIPRM.1993.380666
M. Heimbuch, A. Holmes, M. Mack, S. Denbaars, L. Coldren, J. Bowers
The authors have achieved low threshold In/sub x/Ga/sub 1-x/As/InP quantum well laser diodes, grown in a non-hydride metalorganic chemical vapor deposition system at atmospheric pressure using tertiarybutylarsine and tertiarybutylphosphine. Broad area laser diodes, emitting at 1.3 /spl mu/m, with a 1500 /spl Aring/ GaInAsP active region achieved threshold current densities of 1.25 kA/cm/sup 2/ for 400 micron cavity length. Strained and unstrained quantum wells with luminescence at 1.55 /spl mu/m have been incorporated into the active regions of laser diodes. Lattice matched In/sub 0.53/Ga/sub 0.47/As/InP single quantum well lasers exhibited extremely low threshold current densities of 220 A/cm/sup 2/ for broad area devices 3.5 mm in cavity length. Compressively strained 4 quantum wells devices displayed excellent threshold current densities of 300 A/cm/sup 2/ for 3 mm cavity lengths.<>
利用叔丁基larsin和叔丁基磷化氢在非氢化物金属有机化学气相沉积系统中制备了低阈值的In/sub x/Ga/sub 1-x/As/InP量子阱激光二极管。广域激光二极管的发射速度为1.3 /spl μ m,具有1500 /spl的Aring/ GaInAsP有源区域,在400微米腔长下实现了1.25 kA/cm/sup /的阈值电流密度。发光强度为1.55 /spl mu/m的应变和非应变量子阱已被纳入激光二极管的有源区。晶格匹配的In/sub 0.53/Ga/sub 0.47/As/InP单量子阱激光器在腔长3.5 mm的广域器件上表现出极低的阈值电流密度,为220 A/cm/sup 2/。压缩应变4量子阱器件在3 mm腔长下显示出优异的阈值电流密度为300 A/cm/sup 2/。
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引用次数: 0
Impurity related interface effects in GSMBE grown InP InP生长GSMBE中杂质相关界面效应
Pub Date : 1993-04-19 DOI: 10.1109/ICIPRM.1993.380698
K. Rakennus, J. Likonen, J. Nappi, K. Tappura, H. Asonen, M. Pessa
The authors have found a highly conductive n-type interface layer between semi-insulating InP substrate and undoped InP layer grown by gas source molecular beam epitaxy. Due to this interfacial layer the measured Hall mobilities at 300 K and 77 K are underestimated and carrier concentration is overestimated. The secondary ion mass spectrometry depth profiles reveal an accumulation of silicon and carbon at the interface. The samples were grown on differently pretreated substrates. It seems that silicon and carbon contaminations originate from the exposure to air during the loading to the growth chamber.<>
在半绝缘InP衬底和未掺杂InP衬底之间,通过气源分子束外延生长出了高导电性的n型界面层。由于该界面层的存在,在300k和77k下测量的霍尔迁移率被低估,载流子浓度被高估。二次离子质谱深度剖面揭示了硅和碳在界面处的积累。样品在不同的预处理基质上生长。硅和碳污染似乎是由于在装载到生长室的过程中暴露在空气中造成的。
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引用次数: 0
High performance InGaAs/InP JFETs with step-doped channel doping for OEIC receivers 用于OEIC接收机的阶梯掺杂通道的高性能InGaAs/InP jfet
Pub Date : 1993-04-19 DOI: 10.1109/ICIPRM.1993.380654
M. Blaser, R. Bauknecht, H. Melchior
The structure of InGaAs/InP junction field effect transistors with step-doped channel profiles for optoelectronic integrated circuit (OEIC) receiver applications is described. Transistors with a gate length of 3 microns have transconductances of 140 mS/mm, transit frequencies of 11.6 GHz and gate leakage currents around 1 /spl mu/A/mm. An excess noise factor of 1.5 was measured for transistors operated in optoelectronic integrated receivers.<>
描述了用于光电集成电路(OEIC)接收器的阶梯掺杂InGaAs/InP结场效应晶体管的结构。栅极长度为3微米的晶体管的跨导率为140 mS/mm,传输频率为11.6 GHz,栅极泄漏电流约为1 /spl mu/ a /mm。在光电集成接收机中工作的晶体管的过量噪声系数为1.5。
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引用次数: 0
Atomic layer epitaxy of InP and InAs/InP heterostructures InP和InAs/InP异质结构的原子层外延
Pub Date : 1993-04-19 DOI: 10.1109/ICIPRM.1993.380697
C. Tran, R. Masut, J. Brebner, M. Jouanne, R. Leonelli
The samples used for this study were InAs/InP strained single quantum wells and strained superlattices (SLS) grown by atomic layer epitaxy (ALE). The growth of InAs on InP is strongly influenced by the large lattice mismatch (3.22%). High resolution X-ray diffraction (HRXRD) was carried out. HRXRD can be used to quickly and precisely evaluate the ALE self-limiting growth rate of both InP and InAs. Using interference of X-ray wave fields in a ALE grown InP with an InAs marker layer the authors have accurately determined the growth per cycle. Raman spectra of AL grown InAs/InP SLSs show clearly the longitudinal acoustical folded modes and the longitudinal optic confined modes for both InAs and InP layers. The results indicate that despite the 3.2% lattice mismatch, ALE is a powerful method for fabricating highly strained InAs/InP structures with atomically controlled heterointerfaces.<>
本研究使用的样品是InAs/InP应变单量子阱和原子层外延(ALE)生长的应变超晶格(SLS)。InAs在InP上的生长受到较大的晶格失配(3.22%)的强烈影响。进行了高分辨率x射线衍射(HRXRD)。HRXRD可以快速准确地评价InP和InAs的ALE自限生长速率。利用x射线波场的干涉,在有InAs标记层的ALE生长的InP中,作者准确地确定了每个周期的生长。AL生长的InAs/InP SLSs的拉曼光谱清楚地显示了InAs和InP层的纵向声学折叠模式和纵向光学受限模式。结果表明,尽管存在3.2%的晶格失配,但ALE是制造具有原子控制异质界面的高应变InAs/InP结构的有力方法。
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引用次数: 0
期刊
1993 (5th) International Conference on Indium Phosphide and Related Materials
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