Yongxun Liu, T. Matsukawa, K. Endo, M. Masahara, K. Ishii, S. O'Uchi, H. Yamauchi, J. Tsukada, Y. Ishikawa, E. Suzuki
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引用次数: 32
Abstract
We have successfully developed the advanced FinFET fabrication processes for materializing FinFET CMOS circuits. Using the developed technologies, we demonstrate the advanced TiN metal gate, fin-height controlled FinFET CMOS inverter with an excellent transfer performance, and the flexible threshold voltage, asymmetric gate insulator thickness four-terminal (4T) FinFET with a greatly improved subthreshold (S) slope, for the first time