D. Temple, C. Bower, D. Malta, J.E. Robinson, P.R. Coffinan, M. Skokan, T. Welch
{"title":"High Density 3-D Integration Technology for Massively Parallel Signal Processing in Advanced Infrared Focal Plane Array Sensors","authors":"D. Temple, C. Bower, D. Malta, J.E. Robinson, P.R. Coffinan, M. Skokan, T. Welch","doi":"10.1109/IEDM.2006.346980","DOIUrl":null,"url":null,"abstract":"The paper describes a platform technology for three-dimensional (3-D) integration of multiple layers of silicon integrated circuits. The technology promises to dramatically enhance on-chip signal processing capabilities of a variety of sensor and actuator devices hybridized with Si electronics. Among these applications are high performance infrared focal plane array detectors","PeriodicalId":366359,"journal":{"name":"2006 International Electron Devices Meeting","volume":"43 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2006-12-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"26","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2006 International Electron Devices Meeting","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IEDM.2006.346980","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 26
Abstract
The paper describes a platform technology for three-dimensional (3-D) integration of multiple layers of silicon integrated circuits. The technology promises to dramatically enhance on-chip signal processing capabilities of a variety of sensor and actuator devices hybridized with Si electronics. Among these applications are high performance infrared focal plane array detectors
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