Cantilever type probe card for at-speed memory test on wafer

Abstract

In this paper, we present a new low cost probe card, which enables high speed (500 MHz) memory test on wafer. Since it is difficult to characterize memory devices on wafer at high speed with a low cost probe card, then high speed memory test is usually conducted after assembling packages, although package test requires long lead time for test. We have tested Embedded DRAM at 500 MHz on wafer with the new probe card which has Cantilever needles. The results show that the probe card can be used for memory at-speed test up to 500 MHz.