Design and Optimization of High-Speed Digital Bus Over RF Channel

Nikhita Baladari, R. Wenzel
{"title":"Design and Optimization of High-Speed Digital Bus Over RF Channel","authors":"Nikhita Baladari, R. Wenzel","doi":"10.1109/EPEPS53828.2022.9947153","DOIUrl":null,"url":null,"abstract":"Integration of high-speed digital electronics and high-frequency radar channels in a package with limited layers can result in compromised return paths and degraded signal integrity. In this paper, we designed a digital block over a 77 GHz RF channel and used different package models to evaluate the digital coupling between the digital and RF blocks and the effect on their signal integrity.","PeriodicalId":284818,"journal":{"name":"2022 IEEE 31st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)","volume":"35 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-10-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 IEEE 31st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEPS53828.2022.9947153","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

Abstract

Integration of high-speed digital electronics and high-frequency radar channels in a package with limited layers can result in compromised return paths and degraded signal integrity. In this paper, we designed a digital block over a 77 GHz RF channel and used different package models to evaluate the digital coupling between the digital and RF blocks and the effect on their signal integrity.
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
基于射频信道的高速数字总线设计与优化
将高速数字电子器件和高频雷达信道集成在一个层数有限的封装中,可能导致返回路径受损和信号完整性降低。在本文中,我们设计了一个77 GHz射频信道上的数字模块,并使用不同的封装模型来评估数字模块和射频模块之间的数字耦合及其对信号完整性的影响。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Improvement of Radiation Characteristics of a 300-GHz On-Chip Patch Antenna with Epoxy Mold Compound (EMC) Encapsulation Codimensional Optimization of Differential Via Padstacks NEXT Effect in Pin-area Routing at Receiver End from Via to Trace Coupling in a 32 Gb/s Channel Interconnect Modeling using a Surface Admittance Operator Derived with the Fokas Method CISPR 25 Radiated Emission Simulation and Measurement Correlation of an Automotive Reinforced Isolated Switch Driver
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1