Resistivity of nanometer-scale films and interconnects: model and simulation

A. E. Yarimbiyik, H. Schafft, R. Allen, M. Zaghloul, D. Blackburn
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Abstract

We have developed a highly versatile simulation program for examining the impact of reduced dimensions on resistivity that goes beyond the work of others, e.g. Fuchs and Mayadas and Shatzkes. The program can simulate the effects of surface and grain-boundary scattering on the resistivity of thin films and lines, either separately or simultaneously. It is used to understand the importance of grain size and how surface and grain boundary scattering impacts the effective resistivity. It predicts how Matthiessen's rule will change with decreasing dimensions, which impacts the ability to determine accurately film thickness and line area from resistance measurements taken at two temperatures.
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纳米尺度薄膜和互连的电阻率:模型和模拟
我们已经开发了一个高度通用的模拟程序,用于检查减小尺寸对电阻率的影响,这超出了其他人的工作,例如Fuchs, Mayadas和Shatzkes。该程序可以单独或同时模拟表面和晶界散射对薄膜和线的电阻率的影响。它用于理解晶粒尺寸的重要性以及表面和晶界散射如何影响有效电阻率。它预测了Matthiessen规则将如何随着尺寸的减小而变化,这影响了在两个温度下通过电阻测量准确确定薄膜厚度和线面积的能力。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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