Demonstration on Warpage Estimation Approach Utilized in Fan-Out Panel-Level Packaging Enabled by Multi-Scale Process-Oriented Simulation

Abstract

Despite of the enlarged area of the fan-out panel-level packaging (FO-PLP), the process-induced warpage may cause a serious yielding problem in the subsequent process and assembly for the package. The finite element analysis (FEA) is proposed in many researches to overcome the problem of time cost. The important issue is the discontinuous model and warpage after the sawing process from panel to strip, and strip to unit package for FEA. In this research, a redistribution layer (RDL) first FO-PLP is presented with integrated multiple scale of package model in FEA analysis. The equivalent materials method and the equivalent stress-free temperature in the process-orientation simulation is applied on RDL. The chemical shrinkage of molding underfill is also concerned. The multipoint constraint method is applied on the boundary of multiple scale model to solve the multiple scale problem with panel and strip. The warpage error between the simulation and experiment are below 10 %.