An Accurate Lifetime Analysis Methodology Incorporating Governing NBTI Mechanisms in High-k/SiO2 Gate Stacks

A. Neugroschel, G. Bersuker, R. Choi, C. Cochrane, P. Lenahan, D. Heh, C. Young, C. Kang, B. Lee, R. Jammy
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引用次数: 48

Abstract

Extraction of the intrinsic NBTI degradation rate in the high-k pMOSFETs was found to require correction of the measured threshold voltage shift (DeltaVTH) for the fast transient charging contribution caused by the charge trapping in pre-existing defects in high-k films. The proposed analysis methodology leads to a significantly lower estimated lifetime than that obtained by the generally used approach. It was determined that the interface state generation process contains a fast component most likely associated with the defects in the SiO2 interfacial layer induced by the overlaying high-k film. An intrinsic interface state generation rate obtained by subtracting the fast trapping component is found to be similar to that of the conventional SiO2 dielectric
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结合高k/SiO2栅极堆控制NBTI机制的精确寿命分析方法
高k pmosfet中本征NBTI降解率的提取需要对测量的阈值电压位移(DeltaVTH)进行校正,以弥补高k薄膜中预先存在的缺陷中电荷捕获引起的快速瞬态充电贡献。所提出的分析方法的估计寿命明显低于通常使用的方法。结果表明,界面态生成过程中含有一个快速成分,该成分极有可能与覆盖的高k膜引起的SiO2界面层缺陷有关。通过减去快速捕获分量得到的本征界面态生成速率与传统SiO2介电材料相似
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