Differential Via Optimization for PCIe Gen5 Channel based on Particle Swarm Optimization Algorithm

C. Cho, Kwangho Kim, Manho Lee, Jaeyoung Shin, Sungjin Yoon, Youngjae Lee, Chayoung Song, Wooshin Choi, M. Kwak, Youngdon Choi, Jung-Hwan Choi, Hyungjong Ko
{"title":"Differential Via Optimization for PCIe Gen5 Channel based on Particle Swarm Optimization Algorithm","authors":"C. Cho, Kwangho Kim, Manho Lee, Jaeyoung Shin, Sungjin Yoon, Youngjae Lee, Chayoung Song, Wooshin Choi, M. Kwak, Youngdon Choi, Jung-Hwan Choi, Hyungjong Ko","doi":"10.1109/EPEPS53828.2022.9947193","DOIUrl":null,"url":null,"abstract":"In high-speed SerDes channels, it becomes more important to reduce impedance mismatches to minimize signal return. Most of the mismatches are due to the differential via on PCB which is essential component to make up the PCIe Gen 5 system, and this mismatch should be reduced for the high-speed signal quality. To effectively minimize the mismatch, this paper presents an equation based TDR estimation model of the differential via, and the model is verified to commercial model of the coupled transmission line. And this paper also proposes a method for optimizing the design parameters of the differential via by applying a reward based on TDR impedance to PSO algorithm. The optimization procedure is then applied to one of the actual PCB designs to verify the optimized design parameters.","PeriodicalId":284818,"journal":{"name":"2022 IEEE 31st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)","volume":"30 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-10-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 IEEE 31st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEPS53828.2022.9947193","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1

Abstract

In high-speed SerDes channels, it becomes more important to reduce impedance mismatches to minimize signal return. Most of the mismatches are due to the differential via on PCB which is essential component to make up the PCIe Gen 5 system, and this mismatch should be reduced for the high-speed signal quality. To effectively minimize the mismatch, this paper presents an equation based TDR estimation model of the differential via, and the model is verified to commercial model of the coupled transmission line. And this paper also proposes a method for optimizing the design parameters of the differential via by applying a reward based on TDR impedance to PSO algorithm. The optimization procedure is then applied to one of the actual PCB designs to verify the optimized design parameters.
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基于粒子群算法的PCIe Gen5通道差分通孔优化
在高速SerDes通道中,减少阻抗不匹配以最小化信号返回变得更加重要。大多数不匹配是由于PCB上的差分通孔,这是构成PCIe第5代系统的重要组件,并且这种不匹配应该减少高速信号质量。为了有效地减少失配,本文提出了一种基于方程的差分过孔TDR估计模型,并将该模型与耦合传输线的商业模型进行了验证。提出了一种将基于TDR阻抗的奖励应用于PSO算法的差分通孔设计参数优化方法。然后将优化过程应用于一个实际的PCB设计,以验证优化后的设计参数。
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