{"title":"Reliability of 3D NAND Flash for Future Storage Systems (Invited)","authors":"A. Goda, K. K. Muchherla, Peter Feeley","doi":"10.1109/IRPS48203.2023.10118280","DOIUrl":null,"url":null,"abstract":"The 3D NAND Flash technologies have been successful, having realized the high density, high performance and highly reliable storage systems. With the continuous technology scaling, significant challenges and opportunities are expected in the future. SLC NAND technology plays a critical role for the high performance systems. The increased block size with further layer stacking requires innovative solutions to realize enhanced system performance and cost scaling. For the bits per cell (BPC) scaling beyond QLC, the reduction of the total cost of ownership (TCO) at the system level is the key. In this paper, we review and discuss the challenges and opportunities of 3D NAND reliability from the storage system perspectives.","PeriodicalId":159030,"journal":{"name":"2023 IEEE International Reliability Physics Symposium (IRPS)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2023-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2023 IEEE International Reliability Physics Symposium (IRPS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IRPS48203.2023.10118280","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
The 3D NAND Flash technologies have been successful, having realized the high density, high performance and highly reliable storage systems. With the continuous technology scaling, significant challenges and opportunities are expected in the future. SLC NAND technology plays a critical role for the high performance systems. The increased block size with further layer stacking requires innovative solutions to realize enhanced system performance and cost scaling. For the bits per cell (BPC) scaling beyond QLC, the reduction of the total cost of ownership (TCO) at the system level is the key. In this paper, we review and discuss the challenges and opportunities of 3D NAND reliability from the storage system perspectives.
3D NAND闪存技术已经取得了成功，实现了高密度、高性能和高可靠性的存储系统。随着技术的不断扩展，未来将面临巨大的挑战和机遇。SLC NAND技术在高性能系统中起着至关重要的作用。随着层的进一步堆叠而增加的块大小需要创新的解决方案来实现增强的系统性能和成本扩展。对于超越QLC的每单元位(BPC)扩展，降低系统级的总拥有成本(TCO)是关键。在本文中，我们从存储系统的角度回顾和讨论了3D NAND可靠性的挑战和机遇。
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