Reverse breakdown characteristics in InGa(Al)P/InGaP p-i-n junctions

J. David, M. Hopkinson, R. Ghin, M. Pate
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Abstract

The avalanche breakdown behavior of InGa(Al)P has been investigated by growing a series of pin diode structures covering the material range from InGaP to InAlP. The results show that reverse leakage currents are very low in this material system in keeping with the large band-gap until the onset of avalanche breakdown. Comparing the breakdown voltage (Vbd) with that of GaAs, we find that significant increases are obtained, with InAlP having in excess of twice the Vbd of GaAs. Comparisons with AlGaAs structures of similar band-gap shows that the InGa(Al)P system still has a larger Vbd, suggesting that it may be better for power applications.<>
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InGa(Al)P/InGaP P -i-n结的反向击穿特性
通过生长一系列引脚二极管结构,研究了InGa(Al)P的雪崩击穿行为,这些结构覆盖了从InGaP到InAlP的材料范围。结果表明,在雪崩击穿发生之前,该材料体系的反向泄漏电流非常低,且与大带隙保持一致。将击穿电压(Vbd)与GaAs的击穿电压(Vbd)进行比较,我们发现得到了显着的增加,其中InAlP的Vbd超过GaAs的两倍。与具有相似带隙的AlGaAs结构相比,InGa(Al)P体系仍然具有更大的Vbd,这表明它可能更适合于电源应用。
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Comparisons between conventional LEC, VCZ and VGF for the growth of InP crystals Reliability of InP-based HBT's and HEMT's: experiments, failure mechanisms, and statistics Bulk InP technologies: InP against GaAs Improvement of InAlAs/InP heterointerface grown by MOVPE by using thin AlP layer Low pressure pyrolysis of alternative phosphorous precursors for chemical beam epitaxial growth of InP and related compounds
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