C. Tsai, J. Hsieh, Wei-Heng Lin, L. Yen, J. Hung, T. Peng, Hsi-Ching Wang, Cheng-Yu Kuo, I.L. Huang, W. Chu, Yi-Yang Lei, C. H. Yu, L. Sheu, C. Hsieh, C. S. Liu, K. Yee, Chuei-Tang Wang, Doug C. H. Yu
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引用次数: 11
Abstract
High performance passive devices for millimeter wave (MMW) system, including inductor, ring resonator, power combiner, coupler, balun, transmission line, and antenna, are first realized using integrated fan-out (InFO) wafer level packaging technology. The inductors has quality factor over 40; the power combiner, coupler, and balun show lower transmission loss than on-chip passives; antenna has the efficiency of over 60%. These devices on InFO enable low noise and power MMW system for mobile communication and IoT applications.
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