Qinghao Zhang, Ruoyi Xie, F. Guo, Shashwat Sharma, Damian Marek, P. Triverio
{"title":"An Efficient Methodology to Parse and Mesh Large Interconnect Layouts for Electromagnetic Analysis","authors":"Qinghao Zhang, Ruoyi Xie, F. Guo, Shashwat Sharma, Damian Marek, P. Triverio","doi":"10.1109/EPEPS53828.2022.9947115","DOIUrl":null,"url":null,"abstract":"We present a complete methodology to import and mesh the layout of complex interconnect networks for electromag-netic analysis. At first glance, these tasks may seem straightfor-ward. In reality, they require complex geometrical operations, which are not trivial to perform efficiently and robustly for realistic layouts. The methodology is based on publicly-available libraries and generates a conformal surface mesh suitable for the boundary element method. The method is tested on an entire IC package from the Packaging Benchmark Suite.","PeriodicalId":284818,"journal":{"name":"2022 IEEE 31st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)","volume":"226 ","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-10-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 IEEE 31st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEPS53828.2022.9947115","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
We present a complete methodology to import and mesh the layout of complex interconnect networks for electromag-netic analysis. At first glance, these tasks may seem straightfor-ward. In reality, they require complex geometrical operations, which are not trivial to perform efficiently and robustly for realistic layouts. The methodology is based on publicly-available libraries and generates a conformal surface mesh suitable for the boundary element method. The method is tested on an entire IC package from the Packaging Benchmark Suite.