R. Rengarajan, R. Malik, Haining Yang, W. Yan, R. Ramachandran, Boyong He, R. Divakaruni, Yujun Li
{"title":"Integration of high performance dual workfunction logic CMOS transistors with a dense 8F/sup 2/ vertical DRAM cell","authors":"R. Rengarajan, R. Malik, Haining Yang, W. Yan, R. Ramachandran, Boyong He, R. Divakaruni, Yujun Li","doi":"10.1109/VLSIT.2002.1015387","DOIUrl":null,"url":null,"abstract":"In this paper, we report on integration of high performance dual workfunction logic CMOS transistors with a commodity 8F/sup 2/ vertical DRAM cell for high performance stand-alone DRAM and low-cost low-power embedded DRAM applications. Key process integration features that exploit novel aspects of the vertical DRAM cell to enable a high performance embedded DRAM technology are presented. The impact of pre-metal-dielectric reflow thermal budget on dual workfunction CMOS device characteristics is discussed.","PeriodicalId":103040,"journal":{"name":"2002 Symposium on VLSI Technology. Digest of Technical Papers (Cat. No.01CH37303)","volume":"9 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2002-06-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2002 Symposium on VLSI Technology. Digest of Technical Papers (Cat. No.01CH37303)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/VLSIT.2002.1015387","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
In this paper, we report on integration of high performance dual workfunction logic CMOS transistors with a commodity 8F/sup 2/ vertical DRAM cell for high performance stand-alone DRAM and low-cost low-power embedded DRAM applications. Key process integration features that exploit novel aspects of the vertical DRAM cell to enable a high performance embedded DRAM technology are presented. The impact of pre-metal-dielectric reflow thermal budget on dual workfunction CMOS device characteristics is discussed.