Current Issues in the Bulk Growth of S.i. III-V Materials

G. Muller, G. Hirt, D. Hofmann
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引用次数: 1

Abstract

The present status of crystal growth technology for preparing s.i. GaAs and InP is briefly reviewed considering LEC-techniques and improved versions as wen as Vertical Bridgman techniques. In the second part the post growth thermal treatment of crystals and wafers is discussed. Ingot and wafer annealing are commonly used procedures to improve the material properties of s.i. GaAs. Wafer annealing has only recently gained attraction for 10 since the preparation of nominally undoped s.i. InP has been demonstrated by our group. Finally the potential of new developments in the processing of s.i. III-V bulk growth will be discussed.
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s.i. III-V材料批量增长的当前问题
简要介绍了晶体生长技术在制备砷化镓和铟磷方面的研究现状,包括lece技术和改进版本以及垂直桥桥技术。第二部分讨论了晶体和晶圆的生长后热处理。铸锭退火和晶片退火是提高si砷化镓材料性能的常用方法。晶片退火最近才引起了人们的注意,因为我们的团队已经证明了名义上未掺杂的si InP的制备。最后,将讨论s.i. III-V体生长加工新发展的潜力。
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