{"title":"Finite element analysis of 2.5D packaging processes based on multi-physics field coupling for predicting the reliability of IC components","authors":"","doi":"10.1016/j.microrel.2024.115530","DOIUrl":null,"url":null,"abstract":"<div><div>The 2.5D packaging technology is a high–performance method for electronic packaging. This study addresses the reliability issues of 2.5D packaging during the manufacturing process. A multi–physics field coupling Finite Element Method (FEM) has been developed, combined with sub–modeling techniques, to investigate the curing of underfill adhesive, the curing of Epoxy Molding Compound (EMC), and the reflow soldering between the interposer and substrate in a 2.5D packaging entity during various manufacturing procedures. The focus is on the thermo–mechanical–chemical behavior of viscoelastic components within the packaging structure, as well as the viscoplastic characteristics of the micro solder balls and microbumps. A systematic analysis is conducted on the warpage deformation and stress distribution of the 2.5D packaging at crucial time points. The results demonstrate that after curing, the overall warpage of the packaging exhibits a ‘concave’ warpage profile. Additionally, as the thickness of the EMC above the chip increases, the warpage value of the packaging also increases. The warpage value defined by linear elasticity is larger than that defined by viscoelasticity. The maximum Von Mises stress value in the key areas of the submodel is greater than the maximum Von Mises stress value in the corresponding key areas of the global model. After reflow soldering, the stress concentration in the micro solder balls occurs at the edge of the micro solder ball array. The maximum stress values for each component of the packaging are observed in the interface areas between the components. Packaging components that undergo the curing process have notably higher warpage and Von Mises stress values than those that do not undergo the curing process. The simulation method established in this study can accurately predict the warpage deformation and stress distribution state of 2.5D packaging, providing significant engineering application value for process optimization and reliability enhancement of 2.5D packaging in the production process.</div></div>","PeriodicalId":51131,"journal":{"name":"Microelectronics Reliability","volume":null,"pages":null},"PeriodicalIF":1.6000,"publicationDate":"2024-10-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Microelectronics Reliability","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0026271424002105","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
The 2.5D packaging technology is a high–performance method for electronic packaging. This study addresses the reliability issues of 2.5D packaging during the manufacturing process. A multi–physics field coupling Finite Element Method (FEM) has been developed, combined with sub–modeling techniques, to investigate the curing of underfill adhesive, the curing of Epoxy Molding Compound (EMC), and the reflow soldering between the interposer and substrate in a 2.5D packaging entity during various manufacturing procedures. The focus is on the thermo–mechanical–chemical behavior of viscoelastic components within the packaging structure, as well as the viscoplastic characteristics of the micro solder balls and microbumps. A systematic analysis is conducted on the warpage deformation and stress distribution of the 2.5D packaging at crucial time points. The results demonstrate that after curing, the overall warpage of the packaging exhibits a ‘concave’ warpage profile. Additionally, as the thickness of the EMC above the chip increases, the warpage value of the packaging also increases. The warpage value defined by linear elasticity is larger than that defined by viscoelasticity. The maximum Von Mises stress value in the key areas of the submodel is greater than the maximum Von Mises stress value in the corresponding key areas of the global model. After reflow soldering, the stress concentration in the micro solder balls occurs at the edge of the micro solder ball array. The maximum stress values for each component of the packaging are observed in the interface areas between the components. Packaging components that undergo the curing process have notably higher warpage and Von Mises stress values than those that do not undergo the curing process. The simulation method established in this study can accurately predict the warpage deformation and stress distribution state of 2.5D packaging, providing significant engineering application value for process optimization and reliability enhancement of 2.5D packaging in the production process.
期刊介绍:
Microelectronics Reliability, is dedicated to disseminating the latest research results and related information on the reliability of microelectronic devices, circuits and systems, from materials, process and manufacturing, to design, testing and operation. The coverage of the journal includes the following topics: measurement, understanding and analysis; evaluation and prediction; modelling and simulation; methodologies and mitigation. Papers which combine reliability with other important areas of microelectronics engineering, such as design, fabrication, integration, testing, and field operation will also be welcome, and practical papers reporting case studies in the field and specific application domains are particularly encouraged.
Most accepted papers will be published as Research Papers, describing significant advances and completed work. Papers reviewing important developing topics of general interest may be accepted for publication as Review Papers. Urgent communications of a more preliminary nature and short reports on completed practical work of current interest may be considered for publication as Research Notes. All contributions are subject to peer review by leading experts in the field.