Synthesis and investigation on the structural and complex impedance analysis in LISICON compound, Li3Al2(PO4)3, for solid electrolyte battery applications
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引用次数: 0
Abstract
LiSICON materials have gained significant attention due to their exceptional ionic conductivity at elevated temperatures, positioning them as promising candidates for energy storage and other emerging applications. This study investigates Li3Al2(PO4)3, a compound with notable potential as a solid electrolyte. X-ray diffraction (XRD) confirmed the crystalline phase, while scanning electron microscopy (SEM) and energy-dispersive X-ray spectroscopy (EDX) provided insights into its morphology and composition, ensuring accurate stoichiometry. The electrical and dielectric properties were investigated using complex impedance spectroscopy (CIS), revealing a high sensitivity to frequency and temperature. Detailed impedance measurements across various conditions elucidated the material’s behavior, with Nyquist plots indicating contributions from both grains and grain boundaries, characteristic of non-Debye-type relaxation. Jonscher’s power law was applied to the AC conductivity data, demonstrating that the conduction mechanism aligns with the correlated barrier hopping (CBH) model, driven by the hopping of Li+ ions. Notably, Li3Al2(PO4)3 exhibited a high permittivity value (ε ~ 104), indicating excellent dielectric properties and significant energy storage capacity. These findings underscore the potential of Li3Al2(PO4)3 as a high-performance solid electrolyte for high-temperature applications, particularly in energy storage devices.
期刊介绍:
The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.