Heiddy P. Quiroz, Cristian L. Terán, Jorge A. Calderón, A. Dussan
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引用次数: 0
Abstract
Resistive Random Access Memories (RRAMs) traditionally utilize a metal/insulator/metal architecture. This study introduces an innovative configuration employing metal/oxide-diluted magnetic semiconductors (O-DMS)/metal on flexible substrate, leveraging the enhanced performance of magnetic control in resistive switching. We investigated the structural, morphological, magnetic, and electrical properties of cobalt-doped ZnO and TiO2 thin films, synthesized via DC magnetron sputtering. XRD measurements stablish the presence of Co3O4 phases in the samples of Co-doped ZnO thin films with substrate temperature (Ts) of 423 K, while Raman spectra of Co-doped TiO2 thin film not evidencing the formation of the Co–O binary phases associated to the low substrate temperature (Ts = 293 K). High-resolution SEM and AFM analyses revealed the formation of small grains on the film surfaces, indicative of the growth mechanisms. When Co target power was increased between 20 and 40 W, the grain size increased from 158.89 ± 4.76 nm to 460.97 ± 13.82 nm. Electrical and magnetic characterizations demonstrated contributions from lattice free electrons, generated by oxygen vacancies, and randomly distributed Co ions within the oxide semiconductor matrix, influencing the SET and RESET states. Comparative analysis of ZnO and TiO2 matrices indicated reduced energy consumption and increased storage capacity, attributed to the modulation of high and low resistive states by magnetic ions within the semiconductor matrix, associated to change between low resistive state (LRS) and HRS occurs (~ 1–3 V).
期刊介绍:
The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.