Enhancement in power factor of Sn and Zn co-doped Bismuth Telluride for thermoelectric applications

IF 2.8 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Journal of Materials Science: Materials in Electronics Pub Date : 2025-02-21 DOI:10.1007/s10854-025-14383-0
Suruchi, Kavita Rani, Vivek Gupta, Ashish Kumar
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引用次数: 0

Abstract

The powdered samples of pure and Sn-Zn co-doped Bi2Te3 were synthesized using the solvothermal method at 200 °C. XRD analysis provided information regarding hexagonal crystal structure and space group R-3 m. The lattice parameters were obtained from Rietveld refinement which shows a decrease after Sn-Zn co-doping. The variation in lattice strain, dislocation density and stacking faults provides information regarding the presence of defects in samples. FESEM confirms the hexagonal plate-like morphology of the synthesized samples. The length of synthesized hexagonal nanoplates was in the range of 70–270 nm and the thickness was in the range of 10–20 nm. EDS spectra provided the elemental composition for all samples. Raman spectroscopy confirms the presence of three vibrational modes \({\text{A}}_{1\text{g}}^{1}\), \({\text{E}}_{\text{g}}^{2}\) and \({\text{A}}_{1\text{g}}^{2}\) in the samples. XPS was used to obtain the chemical states of the elements present in the samples. Hall measurement provided the carrier concentration in the range of 1.126 × 1018—7.168 × 1018 cm−3 and mobility in the range of 110–71 cm2/Vs at room temperature. The electrical conductivity of Sn-Zn co-doped samples was increased with increasing doping content and the highest electrical conductivity of 0.658 × 102 S/cm was obtained for Sn0.03Zn0.03Bi1.94Te3 sample at 473 K. The highest value of Seebeck coefficient was observed in the pure sample which is -148.746 μV/K at room temperature. The value of power factor was calculated from electrical conductivity and Seebeck coefficient which shows that the highly doped sample Sn0.03Zn0.03Bi1.94Te3 has the highest value of power factor which is 0.628 × 10–5 Wm−1 K−2 at room temperature which can enhance figure of merit.

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来源期刊
Journal of Materials Science: Materials in Electronics
Journal of Materials Science: Materials in Electronics 工程技术-材料科学:综合
CiteScore
5.00
自引率
7.10%
发文量
1931
审稿时长
2 months
期刊介绍: The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.
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