Tailoring the properties of ZnO thin films by low energy ion beam interaction

IF 2.8 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Journal of Materials Science: Materials in Electronics Pub Date : 2025-02-24 DOI:10.1007/s10854-025-14446-2
Sikta Mandal, Shushant Kumar Singh, Pravin Kumar, Udai P. Singh
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Abstract

Thin films of Zinc Oxide (ZnO) were fabricated using RF sputtering technique on glass as well as ITO substrates. Subsequently, the films were processed by low energy ion beams to modify their properties. The implantation of 200 keV Ni beam was carried out in ZnO films with various ion fluences ranging from 5 E15 to 2 E16 ions/cm2. Characterization of the as deposited and ion beam processed films employed various techniques. The FESEM imaging revealed that ZnO surfaces exhibited rupture indicative of ion incorporation. The XRD analysis highlighted distinct changes. The ZnO films showed enhanced crystallinity after ion implantation. The optical properties studied by UV–Vis Spectroscopy showed that the ion implanted ZnO films have highest transmittance of ~ 80%. As deduced from Hall measurements, the conductivity and carrier concentration in ZnO films increase with increasing the fluences, however, at highest ion fluence, these values decrease. These findings underscore the subtle impact of ion beam processes on semiconductor thin films, crucial for optimizing their performance in electronic applications.

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利用低能离子束相互作用调整ZnO薄膜的性能
采用射频溅射技术在玻璃和ITO衬底上制备了氧化锌薄膜。然后,用低能离子束对薄膜进行处理以改变其性能。在5e15 ~ 2e16离子/cm2的不同离子影响下,在ZnO薄膜中进行了200kev Ni束的注入。采用各种技术对沉积和离子束处理的薄膜进行表征。FESEM成像显示ZnO表面出现破裂,表明离子掺入。XRD分析显示了明显的变化。离子注入后ZnO薄膜的结晶度增强。紫外可见光谱研究表明,离子注入ZnO薄膜的透过率最高,达到80%。根据霍尔测量结果,ZnO薄膜的电导率和载流子浓度随离子影响的增加而增加,但在离子影响最大时,这些值减小。这些发现强调了离子束工艺对半导体薄膜的微妙影响,这对于优化其在电子应用中的性能至关重要。
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来源期刊
Journal of Materials Science: Materials in Electronics
Journal of Materials Science: Materials in Electronics 工程技术-材料科学:综合
CiteScore
5.00
自引率
7.10%
发文量
1931
审稿时长
2 months
期刊介绍: The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.
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