On-die Interconnect Innovations for Future Technology Nodes

M. Kobrinsky
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Abstract

Rapidly evolving requirements for on-die interconnects resulting from scaling and performance needs of current and future products is bringing about an exciting acceleration of the rate of innovations. In this paper, we will link evolutionary technology node needs and disruptive trends to interconnect requirements and to the key technologies needed to address future challenges, which include the introduction of new materials, as well as new geometries and structures.
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面向未来技术节点的片上互连创新
由于当前和未来产品的规模和性能需求,对芯片上互连的需求迅速发展,这带来了令人兴奋的创新速度的加速。在本文中,我们将把进化的技术节点需求和颠覆性趋势与互连要求和应对未来挑战所需的关键技术联系起来,这些挑战包括引入新材料,以及新的几何形状和结构。
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