{"title":"On-die Interconnect Innovations for Future Technology Nodes","authors":"M. Kobrinsky","doi":"10.1109/IITC51362.2021.9537483","DOIUrl":null,"url":null,"abstract":"Rapidly evolving requirements for on-die interconnects resulting from scaling and performance needs of current and future products is bringing about an exciting acceleration of the rate of innovations. In this paper, we will link evolutionary technology node needs and disruptive trends to interconnect requirements and to the key technologies needed to address future challenges, which include the introduction of new materials, as well as new geometries and structures.","PeriodicalId":6823,"journal":{"name":"2021 IEEE International Interconnect Technology Conference (IITC)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2021-07-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2021 IEEE International Interconnect Technology Conference (IITC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IITC51362.2021.9537483","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
Rapidly evolving requirements for on-die interconnects resulting from scaling and performance needs of current and future products is bringing about an exciting acceleration of the rate of innovations. In this paper, we will link evolutionary technology node needs and disruptive trends to interconnect requirements and to the key technologies needed to address future challenges, which include the introduction of new materials, as well as new geometries and structures.