Automated voids detection for metal filled trenches with bottom CD of 10nm

M. Hosseini, G. Martinez, M. H. van der Veen, N. Jourdan, E. Litta, N. Horiguchi
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引用次数: 1

Abstract

The focus of this paper is on automatic methodology to detect the sidewall voids in narrow trenches filled by Ru. For this purpose, we applied image processing techniques for image recognition and labeling of images obtained by high-angle-annular-dark-field scanning TEM (HAADF-STEM). Roughly 3300 STEM images of narrow trenches with BCD of 10nm and AR>8 were labeled. This paper demonstrates the versatility and potential of image processing to address the automated void detection in advance MOL applications.
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底部CD为10nm的金属填充沟槽的自动空洞检测
本文的研究重点是用自动方法来检测由Ru填充的狭窄战壕的侧壁空洞。为此,我们应用图像处理技术对高角度环形暗场扫描TEM (HAADF-STEM)获得的图像进行识别和标记。标记了约3300张BCD为10nm、AR>8的窄沟STEM图像。本文展示了图像处理的多功能性和潜力,以解决提前MOL应用中的自动空洞检测问题。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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