Hardware synthesis for stack type partitioned-bus architecture

Kisun Kim, Kiyoung Choi, Young-Hyun Jun
{"title":"Hardware synthesis for stack type partitioned-bus architecture","authors":"Kisun Kim, Kiyoung Choi, Young-Hyun Jun","doi":"10.1109/ICVC.1999.820830","DOIUrl":null,"url":null,"abstract":"Due to an efficient interconnect structure and internal parallelism, partitioned-bus architecture is viable for deep sub-micron chip design. In this paper, we propose a new partitioned-bus architecture and its supporting high-level synthesis methodology. The new architecture extends an existing linear architecture by stacking multiple layers for handling large datapath intensive applications. Experiments show that the approach generates compact datapath layout with flexibility of aspect ratio and reduces average bus driving length.","PeriodicalId":13415,"journal":{"name":"ICVC '99. 6th International Conference on VLSI and CAD (Cat. No.99EX361)","volume":"52 1","pages":"81-84"},"PeriodicalIF":0.0000,"publicationDate":"1999-10-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"ICVC '99. 6th International Conference on VLSI and CAD (Cat. No.99EX361)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICVC.1999.820830","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1

Abstract

Due to an efficient interconnect structure and internal parallelism, partitioned-bus architecture is viable for deep sub-micron chip design. In this paper, we propose a new partitioned-bus architecture and its supporting high-level synthesis methodology. The new architecture extends an existing linear architecture by stacking multiple layers for handling large datapath intensive applications. Experiments show that the approach generates compact datapath layout with flexibility of aspect ratio and reduces average bus driving length.
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栈型分区总线体系结构的硬件综合
由于高效的互连结构和内部并行性,分区总线架构在深亚微米芯片设计中是可行的。在本文中,我们提出了一种新的分区总线体系结构及其支持的高级综合方法。新架构扩展了现有的线性架构,通过堆叠多层来处理大型数据路径密集型应用程序。实验结果表明,该方法生成了紧凑的数据路径布局,具有宽高比的灵活性,减少了总线的平均行驶长度。
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